Results 241 to 250 of about 31,512 (303)

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Sagittal alignment to predict efficiency in pulsed radiofrequency for cervical facet joint pain. [PDF]

open access: yesSci Rep
Yen CY   +8 more
europepmc   +1 more source

Home - About - Disclaimer - Privacy