Results 211 to 220 of about 326,529 (303)

In Situ Two‐Dimensional Residual Stress Characterization of Thin Films

Advanced Materials Technologies, EarlyView.
An integrated in situ curvature metrology platform combining speckle‐based curvature optical metrology (SCOM) with multi‐beam optical sensors (MOS) enables spatially resolved two‐dimensional curvature mapping of thick sputtered coatings. The SCOM technique provides excellent agreement with MOS while providing an extended measurable curvature range ...
Wai Jue Tan, Wadwan Singhapong, Arindam Majhi, Chris Bowen, Alexander J.G. Lunt, Hongchang Wang, Kawal Sawhney   +6 more
wiley   +1 more source

Resource-state quantum RAM for fast and error-correctable queries. [PDF]

Nat Commun
Cesa F, Bernien H, Pichler H.
europepmc   +1 more source

Liquid‐Crystal‐Based Reconfigurable Intelligent Surface for 7 GHz Mobile Communication

Advanced Materials Technologies, EarlyView.
The glass‐based liquid‐crystal reconfigurable intelligent surface (LC‐RIS) integrates active‐matrix driving and blind‐greedy phase optimization within a 5G‐NR OFDM framework. This enables continuously tunable and autonomous enhancement of wireless coverage. Leveraging the transparency and manufacturability of liquid crystal panels, it is ideally suited
Tien‐Lun Ting, Yuh‐Chyi Chang, Yi‐Chan Hung, Cheng‐Yuan Hsiao, Chao‐Kai Wen, Tsung‐Hsien Lin   +5 more
wiley   +1 more source

Assessment of particulate matter exposure levels and associated respiratory symptoms among oil seed processing factories workers. [PDF]

Sci Rep
Ayano B, Mekonen S, Dadi D.
europepmc   +1 more source

Toward Perception‐Native Electronic Skin: Bio‐Inspired In‐/Near‐Sensor and Neuromorphic Computing for Humanoid Robots

Advanced Materials Technologies, EarlyView.
Dense tactile streams from across the humanoid body converge on collide in a central wiring and data bottleneck. By relocating computation closer to and then into the skin itself, near‐ and in‐sensor architectures, together with neuromorphic computing, chart a path toward perception‐native electronic skin, in which the conversion of stimulus into ...
Mijin Kim, Chang‐Jae Beak, Jiyoung Park, Youngdo Jung, Sunjong Oh, Sin‐Hyung Lee, Bo‐Yeon Lee   +6 more
wiley   +1 more source

Programmable Crack Networks for Wide‐Range and Reversible Strain Sensing in Vertically Oriented van der Waals Molybdenum Disulfide Thin Films

Advanced Materials Technologies, EarlyView.
Vertically oriented van der Waals MoS2 thin films enable a mechanically programmable crack network for strain sensing. The initial mechanical programming protocol establishes a programmed crack configuration along weak interlayer and interdomain interfaces.
Yinli Wang, Hiroyuki Hirakata
wiley   +1 more source

Supply Chain Monitoring and Child Labor: Evidence from Bangladesh Following Rana Plaza

Malkova A, Canon C.
europepmc   +1 more source

Correction: Grewal et al. Diversity and Representation in Cardiovascular Research: Evidence Gaps, Emerging Models, and Policy Implications. <i>Int. J. Environ. Res. Public Health</i> 2026, <i>23</i>, 241. [PDF]

Int J Environ Res Public Health
Grewal S, Wildish J, Chalmers C, Dedding C, Suurmond J, Agyemang C, Grewal N.   +6 more
europepmc   +1 more source

In‐House Manufacturing of 3D ECM Culture Chips via Vacuum Thermoforming for Enhanced Imaging Applications

Advanced Materials Technologies, EarlyView.
Desktop vacuum thermoforming enables rapid, low‐cost fabrication of 96‐channel polystyrene culture chips with very thin imaging interfaces. The resulting platform supports cell lines, primary cells, and patient‐derived organoids, and enables high‐resolution confocal microscopy and single‐cell visualization, providing an accessible approach for advanced
Aleksandra Fomina, Adam Tam, Jennifer Lam, Nila C. Wu, Nancy T. Li, Alison P. McGuigan   +5 more
wiley   +1 more source

Quantifying carbon fluxes in pigs at different production stages: Intake, excretion, and retention. [PDF]

PLoS One
Sattarova E, Lashkari S, Jørgensen HJH, Dalby FR, Børsting CF.   +4 more
europepmc   +1 more source