Results 251 to 260 of about 387,648 (305)
Some of the next articles are maybe not open access.
Study of Dynamic and Static Failure Envelopes
Journal of the Soil Mechanics and Foundations Division, 1966Laboratory tests indicate that the maximum drained shear resistance of cohesionless soils is essentially insensitive to test duration whereas purely cohesive and combined soils offer increased shear resistance described solely by a change in the apparent cohesion intercept of the failure envelope at higher strain rates.
Bruce B. Schimming +2 more
openaire +1 more source
Study of Failure Envelope of Soils
Journal of the Soil Mechanics and Foundations Division, 1963The extension of the Mohr-Coulomb failure criterion to the case of three-dimensional stress was studied by triaxial tests on hollow cylindrical specimens with pore-water pressure measurements. The results on clay agree well with the Mohr-Coulomb envelope expressed in terms of the Hvorslev strength parameters and indicate that the strength is ...
Tien Hsing Wu, A.K. Loh, L E. Malvern
openaire +1 more source
Failure Envelope Curves in Polyethylene Solids
Macromolecular Symposia, 2004AbstractThe present work demonstrates that the failure envelope analysis can be applied for characterizing the ultimate tensile properties of polyethylene solids in which the inhomogeneous necking process is avoided. As a result, the ultimate properties are essentially identical to those of vulcanized rubbers above the glass transition temperature ...
Koh‐hei Nitta, Takashi Ishiburo
openaire +1 more source
Nonlinear Failure Envelope for Soils
Journal of Geotechnical Engineering, 1989The reasons for nonlinearity of failure envelopes for soils are examined and a simple expression for the variation of the angle of shearing strength with stress level is proposed. The nonlinear failure envelope in terms of effective stresses for most soil and rock types can be described by a simple four-parameter expression of hyperbolic type.
openaire +1 more source
Failure envelope of artificially cemented sand
Géotechnique, 2012The present research aims to quantify the influence of the amount of cement, the porosity and the porosity/cement ratio in the assessment of tensile strength and triaxial strength of an artificially cemented sand, as well as in the development of a failure criterion to represent the non-linear failure envelopes of the studied sand–cement mixtures.
N.C. CONSOLI +3 more
openaire +1 more source
An engineering failure envelope for adhesive joints
Experimental Mechanics, 1986An engineering failure envelope (EFE) for adhesive joints is presented and discussed. It is based on local nominal deformation parameters near the free edge of the bond where delamination may start. Tested on a double CLS specimen, this EFE exhibits an easy-to-apply failure envelope. Linear-fracture-mechanics tools show limited capability of predicting
E. Altus, O. Haber, J. Tirosh
openaire +1 more source
Characterizing the Failure Envelope of a Conductive Adhesive
Journal of Electronic Packaging, 1999This paper focuses on mechanical testing designed to determine the static failure envelope for a conductive adhesive. Samples were made by bonding copper pegs together with the conductive adhesive. The samples were then tested at various loading conditions including tension, tension shear, and compression shear.
D. Olliff +4 more
openaire +1 more source
Graphical representation of anisotropic failure envelopes
Engineering Computations, 1989In the design of anisotropic materials, such as advanced fibre‐reinforced composites, the failure envelope has a crucial role. A geometrical representation of the envelope is of particular value to investigate the highly anisotropic nature of the strength of the material. This provides the design engineer with a visualization of the failure envelope by
Wenchao Zhang, K.E. Evans
openaire +1 more source
Characterizing the failure envelope of a conductive adhesive
Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, 2002The importance of flip chip technology is beginning to grow as the use of such technology is seen to be more and more advantageous. The search for alternatives to lead-based solder has also led to the study of conductive adhesives as a possible replacement for solder interconnect technology.
D. Olliff +3 more
openaire +1 more source
Mapping the failure envelope of board-level solder joints
Microelectronics Reliability, 2009Abstract Single solder interconnects were subjected to a series of combined tension–shear and compression–shear tests to determine their failure load. The failure envelope of these interconnects was obtained by plotting the normal component against the shear component of the failure load.
Long Bin Tan +3 more
openaire +1 more source