Results 261 to 270 of about 14,830,293 (403)

Living Liquid Metal Composites Embedded with Electrogenic Endospores for Next‐Generation Bioelectronics

open access: yesAdvanced Functional Materials, EarlyView.
A new class of living liquid metal composites is introduced, embedding Bacillus subtilis endospores into eutectic gallium–indium (EGaIn). The spores enhance droplet coalescence, strengthen interfacial conductivity, and provide on‐demand electrogenic functionality after germination. The composites exhibit high conductivity, self‐healing, patternability,
Maryam Rezaie, Yang Gao, Seokheun Choi
wiley   +1 more source

Behavior of Secondary AE Generation during Low-Cycle Fatigue Test of Austenitic Stainless Steel

open access: bronze, 2014
Makoto Ohta   +4 more
openalex   +2 more sources

From Mechanics to Electronics: Influence of ALD Interlayers on the Multiaxial Electro‐Mechanical Behavior of Metal–Oxide Bilayers

open access: yesAdvanced Functional Materials, EarlyView.
Ultrathin AlOxHy interlayers between aluminum films and polymer substrates significantly improve electro‐mechanical properties of flexible thin film systems. By precisely controlling interlayer thickness using atomic layer deposition, this study identifies an optimal interlayer thickness of 5–10 nm that enhances ductility and delays cracking.
Johanna Byloff   +9 more
wiley   +1 more source

Nano‐ and Micro‐Sized Solid Materials Used as Antiviral Agents

open access: yesAdvanced Functional Materials, EarlyView.
Due to the rise of viral infections in humans and possible viral outbreaks, the use of nano‐ or micro‐sized materials as antiviral agents is rapidly increasing. This review explores their antiviral properties against RNA and DNA viruses, either as a prevention or a treatment tool, by delving into their mechanisms of action and how to properly assess ...
Orfeas‐Evangelos Plastiras   +6 more
wiley   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

open access: yesAdvanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

MAGTWIST: A Magnetically‐Driven Rotary Actuator Using a Traveling‐Wave With Integrated Stiffness Tunability

open access: yesAdvanced Functional Materials, EarlyView.
MAGTWIST: A compact magnetic rotary actuator, enabling smooth, stepless rotation, and on‐demand locking. Inspired by peristalsis, a soft polymer belt generates a traveling‐wave, enabling 270° rotation when heated. Cooling stiffens the belt, locking it in position and enabling it to withstand high loads.
Simon Frieler   +3 more
wiley   +1 more source

Biomaterials‐Based Hydrogel with Superior Bio‐Mimetic Ionic Conductivity and Tissue‐Matching Softness for Bioelectronics

open access: yesAdvanced Functional Materials, EarlyView.
By mimicking the ion‐accelerating effect of ion channel receptors in neuron membranes, a biomaterials‐based ionic hydrogel (BIH) is developed, which offers a high ionic conductivity of 7.04 S m−1, outperforming conventional chitosan, cellulose, agarose, starch, and gelatin based ionic hydrogels.
Baojin Chen   +7 more
wiley   +1 more source

Ultrasound‐Triggered Gelation for Restoring Biomechanical Properties of Degenerated Functional Spinal Units

open access: yesAdvanced Healthcare Materials, EarlyView.
This study introduces an innovative approach to treating intervertebral disc degeneration using ultrasound‐triggered in situ hydrogel formation. Proof‐of‐concept experiments using optimized biomaterial and ultrasound parameters demonstrate partial restoration of biomechanical function and successful integration into degenerated disc tissue, offering a ...
Veerle A. Brans   +11 more
wiley   +1 more source

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