Results 161 to 170 of about 236,153 (262)

Three‐Dimensional Hierarchical Nanowire‐Networks with Deep‐Focus Tolerance and Adhesion Robustness for Harsh‐Environment SERS Sensing

open access: yesAdvanced Functional Materials, EarlyView.
A 3D nanowire‐network SERS substrate with robust adhesion is developed, featuring pronounced z‐direction optical activity, ultralow detection limit (1.5 × 10−13 M), and excellent signal uniformity (RSD < 10%). Enabled by enhanced light scattering, increased optical density of states, and structural reinforcement, the substrate demonstrates stable, high‐
Jinglai Duan   +6 more
wiley   +1 more source

Layer ensemble averaging for fault tolerance in memristive neural networks. [PDF]

open access: yesNat Commun
Yousuf O   +10 more
europepmc   +1 more source

An Ultrafast Self‐Gelling Versatile Hydrogel for Rapid Infected Burn Wound Repair in Military Medicine

open access: yesAdvanced Functional Materials, EarlyView.
A self‐gelling PG@PAC (POD/Gel‐CDH@PA/CHX) powder is developed for infected burn care in austere settings. Upon contact with wound exudate, it instantly forms an adhesive hydrogel, providing simultaneous hemostasis, broad‐spectrum antibacterial activity, reactive oxygen species scavenging, and immunomodulation. In a murine model of S.
Liping Zhang   +14 more
wiley   +1 more source

From Mechanics to Electronics: Influence of ALD Interlayers on the Multiaxial Electro‐Mechanical Behavior of Metal–Oxide Bilayers

open access: yesAdvanced Functional Materials, EarlyView.
Ultrathin AlOxHy interlayers between aluminum films and polymer substrates significantly improve electro‐mechanical properties of flexible thin film systems. By precisely controlling interlayer thickness using atomic layer deposition, this study identifies an optimal interlayer thickness of 5–10 nm that enhances ductility and delays cracking.
Johanna Byloff   +9 more
wiley   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

open access: yesAdvanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

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