Results 161 to 170 of about 236,153 (262)
A 3D nanowire‐network SERS substrate with robust adhesion is developed, featuring pronounced z‐direction optical activity, ultralow detection limit (1.5 × 10−13 M), and excellent signal uniformity (RSD < 10%). Enabled by enhanced light scattering, increased optical density of states, and structural reinforcement, the substrate demonstrates stable, high‐
Jinglai Duan +6 more
wiley +1 more source
Layer ensemble averaging for fault tolerance in memristive neural networks. [PDF]
Yousuf O +10 more
europepmc +1 more source
A self‐gelling PG@PAC (POD/Gel‐CDH@PA/CHX) powder is developed for infected burn care in austere settings. Upon contact with wound exudate, it instantly forms an adhesive hydrogel, providing simultaneous hemostasis, broad‐spectrum antibacterial activity, reactive oxygen species scavenging, and immunomodulation. In a murine model of S.
Liping Zhang +14 more
wiley +1 more source
Fault tolerance in distributed systems using deep learning approaches. [PDF]
Assiri B, Sheneamer A.
europepmc +1 more source
Motifs enable communication efficiency and fault-tolerance in transcriptional networks. [PDF]
Roy S, Ghosh P, Barua D, Das SK.
europepmc +1 more source
Ultrathin AlOxHy interlayers between aluminum films and polymer substrates significantly improve electro‐mechanical properties of flexible thin film systems. By precisely controlling interlayer thickness using atomic layer deposition, this study identifies an optimal interlayer thickness of 5–10 nm that enhances ductility and delays cracking.
Johanna Byloff +9 more
wiley +1 more source
An improved practical Byzantine fault tolerance algorithm for aggregating node preferences. [PDF]
Liu X, Zhu J.
europepmc +1 more source
Control strategy with multivariable fault tolerance module for automatic intravenous anesthesia. [PDF]
Patel B, Patel H, Shah D, Sarvaia A.
europepmc +1 more source
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
Intelligent fault tolerance control using long short-term memory for efficient system performance under fault conditions. [PDF]
El-Mahdy MH +4 more
europepmc +1 more source

