Results 121 to 130 of about 526,533 (356)

Causality Analysis of Construction Failure Using The Event Tree Analysis Method and Fault Tree Analysis

open access: yesRekayasa Sipil
A Hotel Apartment project had to be halted, leaving the existing building abandoned for several years. The adverse impacts of abandoned buildings can be structural, physical, environmental, aesthetic, health, economic, reputational, and ecological ...
Puspita Ambartiyas, Adwitya Bhaskara
doaj   +1 more source

A Cu‐Based Near‐IR Active MOF with an Ion‐Pair Guest Exhibiting Versatile and Selective Gas‐Solid Reactivity

open access: yesAdvanced Materials, EarlyView.
The new Cu‐containing MOF (Me2NH2)(CuICl2)@[Cu4(INA)4Cl2O]·1.5dmf (3) contains a cation and an anion as guests and shows UV‐near‐mid‐IR absorption and near‐IR emission. MOF 3 shows gas‐solid reactivity in the presence of NH3 and HCOOH to yield two new 3D MOF.
Rajat Saha   +10 more
wiley   +1 more source

Risk Analysis of Tubing Hanger Installation Operation Based on T-S Fuzzy Fault Tree

open access: yesShiyou jixie, 2017
To address the lack of fault data, the uncertainty connection of the failure mechanism and the events, and the problem of the applicability of traditional Boolean logic gates in the risk analysis of the tubing hanger installation operation, a new ...
Liu Jian   +4 more
doaj  

Atomistic Mechanisms Triggered by Joule Heating Effects in Metallic Cu‐Bi Nanowires for Spintronics

open access: yesAdvanced Materials, EarlyView.
Bi doped metallic Cu nanowires are promising for spintronics thanks to the stabilization of a giant spin Hall effect. However, heat resulting from current injection forces Bi to leave solution, forcing segregation into monoatomic decorations which evolve into coherent crystalline aggregates.
Alejandra Guedeja‐Marrón   +6 more
wiley   +1 more source

FMEA and FTA Analyses of the Adhesive Joining Process using Electrically Conductive Adhesives

open access: yesActa Polytechnica, 2012
This paper introduces a formulation of appropriate risk estimation methods that can be used for improving of processes in the electronics area. Two risk assessment methods have been chosen with regard to the specifics of adhesive joining based on ...
E. Povolotskaya, P. Mach
doaj  

Thermomechanics of Picoliter Liquids Encapsulated in Metal Microarchitectures

open access: yesAdvanced Materials, EarlyView.
Picoliter‐scale water is encapsulated inside hollow copper microcylinders through a single‐step localized electrodeposition process. Mechanical testing at room and cryogenic temperatures reveals that incompressible liquid and load‐bearing microscale ice enhance the strength and deformation behavior of the composite structure.
Sung‐Gyu Kang   +15 more
wiley   +1 more source

Rewriting Polymer Fate via Chemomechanical Coupling

open access: yesAdvanced Materials, EarlyView.
This work introduces a life‐like “living” polymer platform that can grow, degrow, and reprogram its properties after fabrication. By integrating mass transport, reversible polymerization, and controlled catalysis, the material achieves on‐demand changes in size, shape, and mechanical properties.
Jiahe Huang   +9 more
wiley   +1 more source

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