Results 241 to 250 of about 776,895 (376)
An adaptable FEA simulation of material extrusion additive manufacturing heat transfer in 3D
A. D’Amico, Amy M. Peterson
semanticscholar +1 more source
A plasmonic and intelligent sweat sensing patch for large‐scale health monitoring
We designed a miniaturized and intelligent sweat sensing patch that collects sweat through a microfluidic module and analyzes it using multimodal laser sensing and artificial intelligence‐assisted diagnosis. This patch enables rapid, large‐scale health monitoring and diagnosis by detecting multiple biomarkers in sweat, offering a noninvasive ...
Yuanchao Liu +13 more
wiley +1 more source
Metal Crack Length Prediction and Sensor Fault Self-Diagnosis Method Based on Deep Forest. [PDF]
Gao Q, Meng Y, Li H, Yang B, Huo J.
europepmc +1 more source
Solder‐free room‐temperature multichannel integration for soft hybrid electronics
A room‐temperature direct interconnection (RTDI) technique enables solder‐free, stretchable bonding of multichannel soft–rigid interfaces via hydrogen bonding and molecular entanglement. It achieves 24.7× stronger mechanical bonding than conventional methods and maintains resistance variation within one order of magnitude at 110% strain.
Junchang Wang +13 more
wiley +1 more source
Thinning Antarctic glaciers expose high-altitude nunataks delivering more bioavailable iron to the Southern Ocean. [PDF]
Winter K +7 more
europepmc +1 more source
Abstract Background Titanium nanoparticle (TP) migration into peri‐implant bone may influence osseointegration. It remains unclear how loading protocols may affect TP distribution. This study aimed to detect TP in the bone around implants undergoing different loading protocols in Macaca fascicularis.
Fausto Zamparini +8 more
wiley +1 more source
Fatigue and FEA of zygomatic implant systems in bilateral maxillary defects. [PDF]
Bai H, Wu W, Wang X, Wang Z.
europepmc +1 more source
Recent Developments in Sustainable Composites for Printed Circuit Boards (PCBs): A Review
This review presents the potential of using natural plant fibers and biodegradable polymers as sustainable printed circuit boards (PCBs). This review provides future directions in innovation and sustainable PCBs development. Bio‐composites PCBs are both environmentally friendly and sustainable due to the natural fibres they contain.
Erdem Selver +7 more
wiley +1 more source

