Results 141 to 150 of about 993,385 (313)
Robust Spot Melting by 3D Spot Arrangements in Electron Beam Powder Bed Fusion
This work proposes an approach to replace separately melted contours for spot melting in electron beam powder fusion. Adapting the spot arrangements close to the contour combined with stacking yields a comparable surface quality without the inherent challenges of separate contours, as demonstrated, by electron optical images and roughness measurements.
Tobias Kupfer +4 more
wiley +1 more source
God Sees the Truth, but Waits [PDF]
Non-fiction by Lucinda ...
Kryter, Lucinda
core +1 more source
This study investigates the effects of milling parameters, including rotational speed, milling duration, and ball‐to‐powder ratio, on TiAl particle size and morphology in an XHV‐equivalent atmosphere. The creation of oxide‐free surfaces enhances the mechanical properties of green bodies.
Jytte Möckelmann +4 more
wiley +1 more source
Richard Pine, Lawrence Durrell’s Endpapers and Inklings 1933-1988. Volumes One and Two
Isabelle Keller-Privat
doaj +1 more source
Numerical Exploration of Thermal Shock Resistance in MgO–C Refractories
A mesostructure‐resolved numerical framework is developed to evaluate the thermal shock resistance of MgO–C refractories. By modeling interface debonding under rapid temperature changes and introducing a modified thermal shock parameter that accounts for mesocracks, the study shows how graphite content and aggregate size influence thermal shock ...
Jishnu Vinayak Gopi +3 more
wiley +1 more source
Fatigue Crack Initiation and Growth in Nanocrystalline Ni at Multiple Length‐Scales
Overview of miniaturized in situ SEM fatigue setup and resultant fatigue crack growth data for nanocrystalline Ni. The presented study focuses on the analysis of fatigue crack growth rate (FCGR) in focused ion beam‐notched microcantilevers prepared from nanocrystalline (NC) Ni as a model material.
Igor Moravcik +7 more
wiley +1 more source
Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source

