Results 161 to 170 of about 684,556 (288)
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
High‐Temperature Oxidation of the CrFeNi Medium‐Entropy Alloy
The oxidation behavior of equiatomic CrFeNi MEA is a key issue that determines this material's suitability for high‐temperature application. The understanding of long‐term behavior is even more crucial than short‐term corrosion effects. The alloy is exposed to synthetic air at 1000, 1050, and 1100 °C for 24, 100, and 1000 h and systematically compared ...
Anna Maria Manzoni+5 more
wiley +1 more source
W‐Based Thin Film Metallic Glasses Doped with Ni, Zr, and B for Industrial Applications
This work is the first to deal with a comprehensive comparison of two metallic glass systems, W–Zr–B and W–Ni–B, in terms of their suitability for specific industrial applications. Their mechanical and tribological properties are compared and discussed in combination with structural homogeneity on different types of technically relevant substrates and ...
Zbynek Studeny+5 more
wiley +1 more source
This study designs Ta–Mo–Cr–Ti–Al refractory high‐entropy alloys with a disordered body‐centered‐cubic A2 crystal structure aiming for improved ductility, lower density, and oxidation resistance. Four alloy compositions are identified by thermodynamic calculations.
Kateryna Khanchych+7 more
wiley +1 more source
Highly textured CeO2 nanowires and nanoporous thin films are successfully synthesized by water dissolution of Sr3Al2O6 (SAO) from the SAO:CeO2 vertically aligned nanocomposites (VANs). The morphology of CeO2 can be varied by VAN composition. It demonstrates a new method for synthesizing nanostructured CeO2 without chemical etching or complex micro ...
Benson Kunhung Tsai+8 more
wiley +1 more source
This study explores combining two existing aerospace titanium alloy powders, processing them via field‐assisted sintering technology and the subsequent discovery of a novel alloy composition, termed S23, with ultra‐high tensile toughness. Fine‐scale alpha precipitates favorably form in the alloy despite the relatively slow cooling, providing an ...
Samuel Lister+2 more
wiley +1 more source
Toughness of Confined Auxetic Foams
Auxetic (negative Poisson's ratio) materials offer benefits such as impact mitigation, thermal insulation, vibration damping, and reduced shear strain, although their fracture mechanics are largely unexplored. This study investigates damage initiation and propagation in confined re‐entrant auxetic foams from polyurethane via experimental ...
Adrianos E. F. Athanasiadis+3 more
wiley +1 more source
Correspondence between asymptotically flat spacetimes and nonrelativistic conformal field theories.
Arjun Bagchi
semanticscholar +1 more source
This study presents a multimodal characterization method for a prototype metamaterial model structure that features four distinct states of mechanical stiffness and electrical resistivity. Through simulations and experiments, it uncovers insights into the structural behavior, the correlation between changes in electrical resistivity and mechanical ...
Rebecca Kose+3 more
wiley +1 more source
Herein, the electroplating of titanium from an organic solvent, ethaline, is shown. Polymer additives are shown to smooth the roughness of the film, and small molecule additives are shown to produce a near‐mirror finish to the deposited metal. Titanium electroreduction is desired for a variety of medical, electronic, and bonding applications but has ...
Steven Livers+7 more
wiley +1 more source