Results 81 to 90 of about 228,189 (333)
Low permittivity epoxy nanoporous composites filled with hollow nanosilica
An epoxy nanoporous composite (NPC) filled with hollow nanosilica exhibits lower permittivity than unfilled epoxy resin. The hollow nanosilica is a silica nanoparticle containing a nanometric closed pore.
Muneaki Kurimoto+5 more
doaj +1 more source
Polymer-based nanocomposites with excellent flexibility and intrinsic high breakdown strength are promising candidates for high energy density capacitors compared to ceramics counterparts.
Zhenkang Dan+7 more
doaj +1 more source
Current-Voltage Characteristics of Polymer Light-Emitting Diodes
Conduction in pristine conjugated polymers (other than polyacetylene) is by polaron hopping between sites corresponding to conjugation lengths. The strong increase of current $I$ with voltage $V$ observed for both emission-limited and ohmic contacts is ...
Conwell, E. M., Wu, M. W.
core +1 more source
Evolution of dispersion of carbon nanotubes in Polyamide 11 matrix composites as determined by DC conductivity [PDF]
Double-walled Carbon NanoTubes (DWCNTs) have been dispersed in a Polyamide 11 (PA11) matrix by two routes: in the solvent way, Polyamide 11 was first dissolved in its solvent to ensure a liquid state dispersion of carbon nanotubes by ultrasonic way; in ...
Aridon, Gwenaëlle+5 more
core +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source
Polymer nanocomposites with improved dielectric permittivity and high breakdown strength are extremely desirable for the flexible electronic devices and power systems.
Ming-Sheng Zheng+6 more
doaj +1 more source
This study investigates the influence of ceramic fillers—aluminum oxide, boron nitride, and a combination of aluminum oxide and zinc oxide—with different particle sizes, on the thermal conductivity of solid silicone rubber. Additionally, the impact of potential synergistic interactions from the simultaneous addition of selected fillers is explored to ...
Aryan Oktaee+3 more
wiley +1 more source
Influence of humidity on conduction processes in gas-insulated devices
Humidity has been considered as one of the main influencing factors that determine the conduction processes and electric strength of gas-insulated systems.
Malte Tschentscher+3 more
doaj +1 more source
Microencapsulated paraffin as a tribological additive for advanced polymeric coatings
Numerous tribological applications, wherein the use of liquid lubricants is infeasible, require adequate dry lubrication. Despite the use of polymers as an effective solution for dry sliding tribological applications, their poor wear resistance prevents ...
Reza Gheisari+5 more
doaj +1 more source
The Method of Increasing the Thermostability of Filled Polymers
The individual contribution of stabilizers and fillers into the increase of thermal stability of a polymer-matrix of composite materials at their joint presence in the composite is estimated in this paper. The increase of thermal stability of polypropylene composites in the process of pre-saturation of the surface of fillers by thermal stabilizers ...
PROKOPCHUK NIKOLAY ROMANOVICH+1 more
openaire +2 more sources