Results 1 to 10 of about 347,569 (291)

Microstructure and properties analysis of the brazing alloy prepared from recycled E-waste

Frontiers in Chemistry, 2022
In order to realize the efficient and comprehensive utilization of e-waste resources and short process preparation of alloy brazing materials, this study has analyzed the microstructure and properties of e-waste recycled brazing alloys by the analysis ...
Jiao Yang, Li Bao, Weimin Long, Sujuan Zhong, Jian Qin, Jian Qin, Ruilin Qiao   +6 more
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Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling

Journal of Materials Research and Technology, 2021
In this paper, the intermetallic compound (IMC) growth behaviors of Sn/Cu and Sn–0.6SiC/Cu solder under isothermal aging (50, 100, 150, 200 and 250 h) and thermal cycling (300, 600, 900, 1200 and 1500 cycles) were studied. The results manifested that the
Mu-lan Li, Li-li Gao, Liang Zhang, Wei-min Long, Su-juan Zhong, Lei Zhang   +5 more
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Difficult Jewish Texts and Contemporary Political Crisis

Religions, 2023
This essay considers the phenomenon of public Jewish biblical quotation, such as, for instance, “justice, justice shall you pursue,” in times of contemporary political crisis.
Emily Filler
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Using First-Principles Calculations to Investigate the Interfacial Properties of Ni(100)/Ni₃Al(100) Eutectic Structures

Crystals, 2023
In this paper, the interfacial stabilities of six different stacking interface configurations of Ni(100)/Ni3Al(100) eutectic structures with AlNi termination and Ni termination are calculated by using first-principles methods.
Zongye Ding, Weimin Long, Yongtao Jiu, Tianxing Yang, Sujuan Zhong, Jingwei Yang, Weijie Fu, Jian Qiao   +7 more
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Formation and Morphological Transition of Diversified Eutectic Structures in Ag-Based Brazing Filler Metals with Sn Addition

Crystals, 2022
Eutectic structures in Ag-based brazing filler metals play an important role in improving the properties of alloys and brazed joints. The typical microstructures and morphological evolution of Ag-Cu eutectic structures in Ag-based brazing filler metals ...
Zongye Ding, Weimin Long, Yongtao Jiu, Sujuan Zhong, Danqing Jiang, Chuan Liu, Jingwei Yang, Jian Qiao   +7 more
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Exploring the trace rare earth Sm on the microstructure and mechanical performance of brazed diamonds by Ni–Cr filler alloy

Journal of Materials Research and Technology, 2023
In this study, the properties of Ni-based filler alloy are improved by adding rare earth Sm to them and brazing them at a temperature of 1080 °C. Relevant tests are carried out on filler alloy and brazed joints by means of electron microscopy (SEM ...
Nan Wang, Tian Jin, Huawei Sun, Sujuan Zhong, Guodong Wen, Zhongfang Yan, Dong Xu   +6 more
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Effect of Paste Flux Concentration on Adhesion Behavior

Cailiao gongcheng, 2017
In view of the problem that paste flux is difficult to spread uniformly on the surface of filler metal, the adhesion behavior of the different concentrations of paste flux on the surface of filler metal was studied by the equipment of OM, wetting angle ...
DU Quan-bin, LONG Wei-min, LU Quan-bin, SUN Hua-wei, WANG Xing-xing, BAO Li   +5 more
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Antimicrobial sorbate anchored to layered double hydroxide (LDH) nano-carrier employed as active coating on Polypropylene (PP) packaging: Application to bread stored at ambient temperature

Future Foods, 2021
In this paper it is reported the preparation of a food packaging based on isotactic polypropylene (PP) coated with layered double hydroxide (LDH) hosting sorbate as active molecule.
Gianluca Viscusi, Valeria Bugatti, Vittoria Vittoria, Giuliana Gorrasi   +3 more
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Tuning Electrical Conductivity of CNT-PDMS Nanocomposites for Flexible Electronic Applications [PDF]

, 2015
This paper presents a study into the electrical conductivity of multi-wall carbon nanotube-polydimethylsiloxane (MWNT-PDMS) nanocomposite and their dependence on the filler concentration.
Dahiya, R., Dang, W., Khan, S., Lorenzelli, L., Polat, E.O., Vinciguerra, V., Yogeswaran, N.   +6 more
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Study on the reliability of novel Au–30Ga solder for high-temperature packaging

Journal of Materials Research and Technology, 2020
As a novel high-temperature solder with suitable eutectic temperature and excellent solderability, Au–30Ga eutectic alloy shows high application potential as a packaging material for high-power devices.
Han Liu, Songbai Xue, Yu Tao, Weimin Long, Sujuan Zhong, Bo Wang   +5 more
doaj   +1 more source