Results 221 to 230 of about 1,040,523 (340)

Affecting the Properties of Copper–Graphene Electroconductive Composite by Severe Plastic Deformation

open access: yesAdvanced Engineering Materials, EarlyView.
Copper‐based composites enhanced with carbon feature convenient mechanical properties and favorable electric conductivity. Processing via deformation and thermomechanical treatments can introduce advantageous microstructures further enhancing their performance. Herein, copper–graphene powder‐based composites are directly consolidated via rotary swaging
Radim Kocich   +3 more
wiley   +1 more source

Microstructure Design of Steel‐Spinel Composites via Spark Plasma Sintering Process

open access: yesAdvanced Engineering Materials, EarlyView.
This study illustrates how spark plasma sintering at reduced oxygen partial pressure enables controlled formation of steel‐spinel composites through tailored redox reactions and cation exchange. Comparison of the MgO–Fe2O3, steel–(MgO+Cr2O3), and steel–(MgO+Fe2O3) systems shows how oxygen activity and interface chemistry govern spinel formation, phase ...
Mahnaz Mehdizadehlima   +4 more
wiley   +1 more source

Influence of Post-Processing on S-Phase Formation During Plasma Nitriding of Additively Manufactured Inconel 939. [PDF]

open access: yesMaterials (Basel)
Maj P   +7 more
europepmc   +1 more source

Microstructure Evolution of a VMnFeCoNi High‐Entropy Alloy After Synthesis, Swaging, and Annealing

open access: yesAdvanced Engineering Materials, EarlyView.
The synthesis and processing (rotary swaging and annealing) of the novel VMnFeCoNi alloy is investigated, alongside the estimation of the grain size effect on hardness. Analysis of a wide grain size range of recrystallized microstructures (12–210 µm) reveals a low annealing twin density.
Aditya Srinivasan Tirunilai   +6 more
wiley   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

open access: yesAdvanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad   +6 more
wiley   +1 more source

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