Prediction of 3D High Frequency Eddy Current Loss in Rotor Magnets of SPM Machines [PDF]
This paper proposes a computationally efficient method, for accurate prediction of 3-dimensional (3D) high frequency eddy current loss in the rotor magnets of surface mounted permanent magnet machines employing the imaging method.
Chen, L. +5 more
core +1 more source
A multidimensional molecular strategy optimizes the tribonegative layer by electrospinning PVDF‐HFP for dipole alignment and crystallinity, followed by 2D borophene doping to enhance conductivity and charge trapping. Integrated with Nylon‐66 nanofibers, the composite device delivers a record sensitivity of 53.8 ± 1.2 V kPa−1 at 3 Hz, enabling ultra ...
Sajib Roy +7 more
wiley +1 more source
Dynamic Characteristics Research of a Steel/CFRP Drive Shaft
The dynamic characteristics of a steel/CFRP (carbon fiber reinforced plastic) drive shaft were studied. finite element analysis (FEA) and an experiment were carried out to investigate the natural frequencies and mode shapes. The results of the experiment
Jinguang Zhang +5 more
doaj +1 more source
Finite Element Analysis based on A Parametric Model by Approximating Point Clouds
Simplified models are widely applied in finite element computations regarding mechanical and structural problems. However, the simplified model sometimes causes many deviations in the finite element analysis (FEA) of structures, especially in the non ...
Wei Xu, Ingo Neumann
doaj +1 more source
Thermo-structural Finite Element Analysis of Direct Laser Metal Deposited Thin-Walled Structures [PDF]
Multilayer direct laser metal deposition is a fabrication process in which the parts are fabricated by creating a molten pool into which particles are injected.
Dwivedi, Rajeev +2 more
core +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Characterization Of Thermal Stresses And Plasticity In Through-Silicon Via Structures For Three-Dimensional Integration [PDF]
Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause ...
Ho, P. S. +4 more
core +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source
Practical guidance on the application of R-K integration method in finite element analysis of creep damage problem [PDF]
A practical user guidance of Runge-Kutta (R-K) integration method with the context of non-linear time dependent finite element analysis (FEA) was proposed in this paper.
Liu, Dezheng +3 more
core
Advanced Design for Weakly Coupled Resonators by Automatic Active Optimization
An Automatic Active Optimization (AAO) strategy integrates machine learning predictors and genetic algorithms in a closed‐loop workflow. By iteratively expanding its dataset with new discoveries, AAO overcomes the limits of conventional methods. This approach finds superior microstructural designs beyond the initial sample space. We demonstrate this on
Wei Yue +8 more
wiley +1 more source

