Design, Manufacture and Prospects of Heterostructured Materials
cMat, Volume 2, Issue 4, December 2025.ABSTRACT Heterostructured materials, characterized by distinct microstructures and mechanical properties across different micro‐regions, have consistently demonstrated their ability to effectively mitigate the strength‐ductility trade‐off in structural materials.
Di Wu, Runlian Li, Tianlong Zhang
wiley +1 more source
Health Science Reports, Volume 8, Issue 12, December 2025.ABSTRACT Background and Aims Critical thinking play a vital role in enhancing public health decision‐making by enabling professionals to assess interventions, address complex challenges, and formulate effective policies. This systematic review aims to evaluate the application of structured critical thinking frameworks in public health, highlighting ...
Hussien Saber Hussein +3 more
wiley +1 more source
Analisis Akar Penyebab Masalah dalam Meningkatkan Overall Equipment Effectiveness (Oee) Mesin Stripping Hipack III dan Unimach di PT Pfi [PDF]
, 2015 . Overall Equipment Efectiveness (OEE) is a calculation method used inTotal Productive Maintenance (TPM) to maximize the effectiveness of machinesin industrial facilities.
Alamsyah, F. (Firman)
core
Penerapan Lean Supply Chain pada Proses Loading Pupuk In Bag di Pelabuhan PT. Petrokimia Gresik [PDF]
, 2016 PT. Petrokimia Gresik merupakan salah satu produsen pupuk terbesar di Indonesia yangmempunyai jaringan supply chain lintas negara dan distribusi ke seluruh Nusantara baik pupukcurah maupun pupuk in bag. Penelitian ini dilaksanakan pada pelabuhan PT.
Dare Bodington (3983585) +3 more
core +3 more sources
The Impact of a Buyer's Incentives and Organizational Structure on Suppliers' Quality
Journal of Operations Management, Volume 71, Issue 8, Page 1185-1221, December 2025.ABSTRACT Changes in a buyer organization's incentives and structure can have a significant impact on supply chain performance, such as the quality of sourced components. We examine this relationship using data from a unique quasi‐experiment where one of the two plants of a buyer introduced long‐term quality improvement incentives and a more organic ...
Anupam Agrawal, Ujjal Kumar Mukherjee
wiley +1 more source
SHS Web of Conferences, 2018 This research aims to manage the amount of defective packaging of capsule products in the department of capsule product at PT SM. It is important because the number of defective packaging of capsule products is high and exceeds the limits of maximum, i.e.
Fidiyanti Finsaria, Susanto Novie
doaj +1 more source
Analisis Faktor Penyebab Tandan Buah Segar (TBS) Busuk Dan Bahaya Kecelakaan Menggunakan Fishbone Chart (Studi Kasus Pada Bagian Sortasi di PT Sutopo Lestari Jaya) [PDF]
, 2019 At the PT Sutopo Lestari Jaya sorting work station it was seen that the sorting work environment had an open working environment so that when hot weather operators quickly experienced fatigue and the oil content in FFB would shrink, during the rain the ...
., William
core
MetalMat, Volume 2, Issue 4, December 2025.Since Pb restrictions in the early 2000s, the industry initially adopted high‐temperature solders like Sn–Ag and Sn–Cu. More recently, Sn–Bi alloys have gained traction as low‐temperature soldering (LTS) solutions, particularly for consumer electronics. Current research focuses on solidification behavior, warpage, and joint reliability.
Marcella Gaute Cavalcante Xavier +2 more
wiley +1 more source
ANALISIS PENGENDALIAN MUTU BIBIT KELENGKENG DI CV. TELAGA NURSERY KABUPATEN KLATEN [PDF]
, 2013 Tanaman kelengkeng bukan hanya dibudidayakan sebagai kegemaran dan koleksi saja, tetapi juga dapat ditekuni sebagai bisnis. Salah satu yang menekuni budidaya kelengkeng sebagai bisnis adalah CV. Telaga Nursery.
KUSUMA, ANINDITYA CAHYA
core
Pengendalian Reject Chip Chasing Di Ic Pada Proses Trim and Form Dengan Pendekatan Doe (Study Kasus Di PT. Infineon Technologies Batam) Control of Reject Chip Chasing in Ic Chip of Trim and Form Process Based on Doe Approach (a Case Study in PT. Infineon Technologies Batam) [PDF]
, 2016 Chip casing adalah reject yang termasuk dalam defect category C yaitu adanya sompel atau gompel pada bagian package IC. Terjadinya chip casing membuat proses produksi harus dihentikan untuk melakukan analisis dan perbaikan.
Oppusunggu, L. (Leonardus) +2 more
core +6 more sources