Results 161 to 170 of about 11,090 (264)

Microstructure Modification of Additively Manufactured Mo–9Si–8B by Annealing and Its Effects on High‐Temperature Mechanical Properties

open access: yesAdvanced Engineering Materials, EarlyView.
Postbuild annealing systematically modifies the phase fractions and morphology of EB‐PBF processed Mo–9Si–8B. Quantitative microstructure–property correlations reveal how controlled phase evolution enhances high‐temperature compressive strength and creep resistance.
Christopher Schmidt   +5 more
wiley   +1 more source

Discrepancies Between Micro Versus Macroscale Viscoelastic Properties in a Microplastic‐Tissue Composite Model

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores the discrepancies between bulk mechanics and spatial mapping in a tissue‐mimetic hydrogel model. Microplastic particles create localized stiff mechanical microenvironments that are detectable by cellular‐scale nanoindentation but leave bulk properties unchanged as measured by rheology.
Ahron T. Verschleisser   +3 more
wiley   +1 more source

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

open access: yesAdvanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz   +4 more
wiley   +1 more source

Vulnerability of fishery resources to climate change in the Tropical Eastern Pacific Ecosystem off Peru. [PDF]

open access: yesSci Rep
Ramos JE   +18 more
europepmc   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

Home - About - Disclaimer - Privacy