Results 161 to 170 of about 48,181 (313)

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications. [PDF]

Micromachines (Basel), 2023
Baruah RK, Yoo H, Lee EK.
europepmc   +1 more source

Indium Tungsten Oxide Thin Films for Flexible High-Performance Transistors and Neuromorphic Electronics [PDF]

, 2018
Nidhi Tiwari, Mayank Rajput, Rohit Abraham John, Mohit Rameshchandra Kulkarni, Anh Chien Nguyen, Nripan Mathews   +5 more
openalex   +1 more source

Atomic Size Misfit for Electrocatalytic Small Molecule Activation

Advanced Functional Materials, EarlyView.
This review explores the application and mechanisms of atomic size misfit in catalysis for small molecule activation, focusing on how structural defects and electronic properties can effectively lower the energy barriers of chemical bonds in molecules like H2O, CO2, and N2.
Ping Hong, Changfan Xu, Huaping Zhao, Yong Lei   +3 more
wiley   +1 more source

Design of Polysaccharide-Based Nanocomposites for Eco-Friendly Flexible Electronics. [PDF]

Polymers (Basel)
Turcanu G, Stoica I, Albu RM, Varganici CD, Avadanei MI, Barzic AI, Curecheriu LP, Stagnaro P, Buscaglia MT.   +8 more
europepmc   +1 more source

Continuous Spinning of High-Tough Hydrogel Fibers for Flexible Electronics by Using Regional Heterogeneous Polymerization. [PDF]

Adv Sci (Weinh), 2023
Wu S, Gong C, Wang Z, Xu S, Feng W, Qiu Z, Yan Y.   +6 more
europepmc   +1 more source

Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic-Sintered Copper Membrane for Printed Flexible Hybrid Electronics [PDF]

, 2018
Young‐Tae Kwon, Yun‐Soung Kim, Yong-Kuk Lee, Shinjae Kwon, Minseob Lim, Yoseb Song, Yong‐Ho Choa, Woon‐Hong Yeo   +7 more
openalex   +1 more source

Soft and Stiff 3D Microstructures by Step‐Growth Photopolymerization Using a Single Photoresin and Multi‐Photon Laser Printing

Advanced Functional Materials, EarlyView.
An additive and initiator‐free photoresin based on a prepolymer decorated with photoreactive step‐growth units as crosslinkers allows for the fabrication of 3D microstructures with strongly disparate mechanical properties ranging from stiff to soft. Abstract Manufacturing three‐dimensional (3D) microstructures with multi‐material properties via two ...
Tugce Nur Eren, Jiajie Liang, Jonathan Ludwig Günter Schneider, Martin Wegener, Jens Bauer, Katharina Ehrmann, Florian Feist, Christopher Barner‐Kowollik   +7 more
wiley   +1 more source

Electrically Interconnected Platinum Nanonetworks for Flexible Electronics. [PDF]

ACS Omega
Baig SM, Abe H.
europepmc   +1 more source

Malodour classification with low-cost flexible electronics. [PDF]

Nat Commun, 2023
Ozer E, Kufel J, Biggs J, Rana A, Rodriguez FJ, Lee-Clark T, Sou A, Ramsdale C, White S, Garlapati SK, Valliappan P, Rahmanudin A, Komanduri V, Saez GS, Gollu S, Brown G, Dudek P, Persaud KC, Turner ML, Murray S, Bates S, Treloar R, Newby B, Ford J.   +23 more
europepmc   +1 more source

Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration [PDF]

, 2018
Takafumi Fukushima, Arsalan Alam, Amir N. Hanna, Siva Chandra Jangam, Adeel Bajwa, Subramanian S. Iyer   +5 more
openalex   +1 more source