Results 31 to 40 of about 36,496 (215)

Mechanochemical Synthesis and Characterization of Nanostructured ErB4 and NdB4 Rare‐Earth Tetraborides

Advanced Engineering Materials, Volume 27, Issue 6, March 2025.
ErB4 and NdB4 nanostructured powders are produced by mechanochemical synthesis. 5 h mechanical alloying and 4 M HCl acid leaching are used in the production. ErB4 and NdB4 powders exhibit maximum magnetization of 0.4726 emu g−1 accompanied with an antiferromagnetic‐to‐paramagnetic phase transition at about TN = 18 K and 0.132 emu g−1 with a maximum at ...
Burçak Boztemur, Faruk Kaya, Bora Derin, Mustafa Lütfi Öveçoğlu, Ju Li, Duygu Ağaoğulları   +5 more
wiley   +1 more source

Influence of Cooling Rate on Primary Silicon Size in Hypereutectic Al–Si Alloy Fabricated by Laser Powder Bed Fusion

Advanced Engineering Materials, EarlyView.
Al–Si alloys are particularly in demand for automotive and electronic applications, thanks to their excellent wear and thermal properties. Nevertheless, when processed by conventional methods with low cooling rates, the coarse primary Si phases are responsible for increasing brittleness and inducing crack propagation.
Layla Shams Tisha, Daniel Knoop, Nils Ellendt, Anastasiya Toenjes   +3 more
wiley   +1 more source

Ultra‐Shallow Flat Heat Waves on Low Thermal Conductivity Flexible Polyimide Substrate for Millisecond Thermal Analysis of Materials and Bioelectronic Applications

Advanced Engineering Materials, EarlyView.
An electronic system is presented consisting of a silver thin‐film electrode on a polyimide substrate working both as a heating element and a resistive temperature sensor, generating millisecond heat pulses with very fast heating and cooling rates and a flat peak temperature with a tunable duration.
Bahman K. Boroujeni, Jan Frede, Simon T. Herrmann, Natalie Heinen, Hans Kleemann, Stephanie Pfaender   +5 more
wiley   +1 more source

Advances in Hybrid Icing and Frosting Protection Strategies for Optics, Lens, and Photonics in Cold Environments Using Thin‐Film Acoustic Waves

Advanced Engineering Materials, EarlyView.
This article provides a comprehensive overview of fundamentals and recent advances of transparent thin‐film surface acoustic wave technologies on glass substrates for monitoring and prevention/elimination of fog, ice, and frost. Fogging, icing, or frosting on optical lenses, optics/photonics, windshields, vehicle/airplane windows, and solar panel ...
Hui Ling Ong, Zhangbin Ji, Luke Haworth, Yihao Guo, Jaime del Moral, Stefan Jacob, Ana Borras, Agustin R. Gonzalez‐Elipe, Jikai Zhang, Jian Zhou, Glen McHale, Yong‐Qing Fu   +11 more
wiley   +1 more source

Bistable Mechanisms 3D Printing for Mechanically Programmable Vibration Control

Advanced Engineering Materials, EarlyView.
This work introduces a 3D‐printed bistable mechanism integrated into tuned mass dampers (TMDs) for mechanically adaptive passive vibration suppression. Through optimized geometry, the bistable design provides adaptable vibration reduction across a broad range of scenarios, achieving effective vibration mitigation without complex controls or external ...
Ali Zolfagharian, Frédéric Demoly, Mohammad Lakhi, Bernard Rolfe, Mahdi Bodaghi   +4 more
wiley   +1 more source

Consolidate Overview of Ribonucleic Acid Molecular Dynamics: From Molecular Movements to Material Innovations

Advanced Engineering Materials, EarlyView.
Molecular dynamics simulations are advancing the study of ribonucleic acid (RNA) and RNA‐conjugated molecules. These developments include improvements in force fields, long‐timescale dynamics, and coarse‐grained models, addressing limitations and refining methods.
Kanchan Yadav, Iksoo Jang, Jong Bum Lee
wiley   +1 more source

Spray Deposition for Solvent Annealing of Hybrid Poly(3,4‐Ethylenedioxythiophene) Polystyrene Sulfonate Cellulose Silver Nanowire Composite Electrodes Using a Roll‐to‐Roll Coater

Advanced Engineering Materials, EarlyView.
The fabrication and post‐treatment via solvent annealing of poly(3,4‐ethylenedioxythiophene) polystyrene sulfonate‐based electrodes using spray deposition in a roll‐to‐roll setup are presented. The decrease in sheet resistance and its correlation with nanostructure and molecular structure in the electrodes as a function of the processing parameters is ...
Marie Betker, Benedikt Sochor, Elisabeth Erbes, Alisher Kurmanbay, Tim Erichlandwehr, Yanan Li, Peter Müller‐Buschbaum, Irene Fernandez‐Cuesta, Simone A. Techert, L. Daniel Söderberg, Stephan V. Roth   +10 more
wiley   +1 more source

Flexible Electronics: The Next Ubiquitous Platform

Proceedings of the IEEE, 2012
Thin-film electronics in its myriad forms has underpinned much of the technological innovation in the fields of displays, sensors, and energy conversion over the past four decades. This technology also forms the basis of flexible electronics. Here we review the current status of flexible electronics and attempt to predict the future promise of these ...
Nathan, A, Ahnood, A, Cole, MT, Lee, S, Suzuki, Y, Hiralal, P, Bonaccorso, F, Hasan, T, Garcia-Gancedo, L, Dyadyusha, A, Haque, S, Andrew, P, Hofmann, S, Moultrie, J, Chu, D, Flewitt, AJ, Ferrari, AC, Kelly, MJ, Robertson, J, Amaratunga, GAJ, Milne, WI   +20 more
openaire   +3 more sources

Beyond Order: Perspectives on Leveraging Machine Learning for Disordered Materials

Advanced Engineering Materials, EarlyView.
This article explores how machine learning (ML) revolutionizes the study and design of disordered materials by uncovering hidden patterns, predicting properties, and optimizing multiscale structures. It highlights key advancements, including generative models, graph neural networks, and hybrid ML‐physics methods, addressing challenges like data ...
Hamidreza Yazdani Sarvestani, Surabhi Nadigotti, Erfan Fatehi, Derek Aranguren van Egmond, Behnam Ashrafi   +4 more
wiley   +1 more source

Effect of Acrylic Structural Adhesive as a Joint Reinforcement on Film Deformation during the Thermoforming Process for In‐Mold Electronic Devices

Advanced Engineering Materials, EarlyView.
In‐mold electronics (IME) enables the integration of circuits into more complex scenarios, yet the key challenge remains ensuring a fully functional device. This study investigates how the presence of structural adhesives can improve the performance and functionality of IME devices, addressing key challenges in device integration.
Francisco Ituriel Arias‐García, Nekane Lozano‐Hernandez, Maria Lluisa Maspoch, Enric Fontdecaba   +3 more
wiley   +1 more source