Results 61 to 70 of about 48,181 (313)

A Comprehensive Review of Additive Manufacturing for Space Applications: Materials, Advances, Challenges, and Future Directions

Advanced Engineering Materials, EarlyView.
Additive manufacturing (AM) transforms space hardware by enabling lightweight, high‐performance, and on‐demand production. This review outlines AM processes—powder bed fusion (PBF), directed energy deposition (DED), binder jetting (BJ), sheet lamination (SL), and material extrusion (ME)—applied to propulsion, satellite structures, and thermal devices ...
Stelios K. Georgantzinos, Eleni Papadopoulou, Grigorios Kostopoulos, Stefanos Voulgaris, Alexandra Tseni, Panteleimon Bakalis, Maria Gkara, Chara C. Mitropoulou, Nikos D. Lagaros   +8 more
wiley   +1 more source

Recent Development of Photochromic Polymer Systems: Mechanism, Materials, and Applications

Research
Photochromic polymer is defined as a series of materials based on photochromic units in polymer chains, which produces reversible color changes under irradiation with a particular wavelength.
Jindou Zou, Jimeng Liao, Yunfei He, Tiantian Zhang, Yuxin Xiao, Hailan Wang, Mingyao Shen, Tao Yu, Wei Huang   +8 more
doaj   +1 more source

Large Area, Cost‐Effective, and Ultra‐Fast Fabrication of Mini‐Coils Toward Noninvasive Magnetic Applications

Advanced Engineering Materials, EarlyView.
A simple, cleanroom‐free method produces flexible mini‐coils using automated blade cutting. The process is fast, low‐cost, and supports diverse materials. The coils show strong durability and performance under repeated bending. Demonstrated use in resistor‐inductor filters and magnetic nanoparticle control proves their adaptability.
Changhao Ge, Bhavani Prasad Yalagala, Tahereh Masalehdan, Mahdieh Shojaei Baghini, Danijela Gregurec, Hadi Heidari   +5 more
wiley   +1 more source

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

Advanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García, Nekane Lozano‐Hernandez, Maria Lluisa Maspoch, Enric Fontdecaba   +3 more
wiley   +1 more source

Matrix-induced defects and molecular doping in the afterglow of SiO2 microparticles

Nature Communications
A deep understanding of how the host matrix influences the afterglow properties of molecule dopants is crucial for designing advanced afterglow materials.
Xue Chen, Mengfen Che, Weidong Xu, Zhongbin Wu, Yung Doug Suh, Suli Wu, Xiaowang Liu, Wei Huang   +7 more
doaj   +1 more source

Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli

Advanced Engineering Materials, EarlyView.
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley   +1 more source

Bioinspired Materials, Designs, and Manufacturing Strategies for Advanced Impact‐Resistant Helmets

Advanced Engineering Materials, EarlyView.
This review explores how bioinspired materials, structures, and manufacturing strategies transform helmet design to achieve enhanced impact resistance. Drawing inspiration from nacre, porcupine quills, beetle exoskeletons, and skull architectures, it highlights advances in auxetic lattices, nanocomposites, and functionally graded foams.
Joseph Schlager, Yi Jin, Mohammad Faruk, Jay Alberts, C. Chase Cao   +4 more
wiley   +1 more source

Flexible Electronics: The Next Ubiquitous Platform

Proceedings of the IEEE, 2012
Thin-film electronics in its myriad forms has underpinned much of the technological innovation in the fields of displays, sensors, and energy conversion over the past four decades. This technology also forms the basis of flexible electronics. Here we review the current status of flexible electronics and attempt to predict the future promise of these ...
Nathan, A, Ahnood, A, Cole, MT, Lee, S, Suzuki, Y, Hiralal, P, Bonaccorso, F, Hasan, T, Garcia-Gancedo, L, Dyadyusha, A, Haque, S, Andrew, P, Hofmann, S, Moultrie, J, Chu, D, Flewitt, AJ, Ferrari, AC, Kelly, MJ, Robertson, J, Amaratunga, GAJ, Milne, WI   +20 more
openaire   +3 more sources

3D‐Printable Near‐Infrared‐Responsive Microscale Cantilever made of the Composite Consisting of Ceramic Particles and Graphene Flakes

Advanced Engineering Materials, EarlyView.
A near infrared‐responsive microscale cantilever is developed using a 3D‐printable composite based on photocurable resin consisting of sepiolite and graphene flakes. The material absorbs 1064 nm light, causing shape transformation with an average displacement of 1.3 mm in 1.7 s. Displacement is measured via video recording.
Karolina Laszczyk, Weronika Chuda, Piotr Kamedulski, Damian Nowak   +3 more
wiley   +1 more source

Encapsulating Laser‐Induced Graphene to Preserve its Electrical Properties and Enhance its Mechanical Robustness

Advanced Engineering Materials, EarlyView.
It is demonstrated that laser‐induced graphene (LIG) can be encapsulated while preserving its electrical conductivity and enhancing its mechanical properties. Unlike previous encapsulation attempts, the optimal conditions described here result in sheet resistance of ≈2 Ω sq−1, resistance increase of only 5% upon encapsulation, and vastly improved ...
Fatemeh Bayat, Mohammad Nazeri, Gerd Grau, Simone Pisana   +3 more
wiley   +1 more source