Results 161 to 170 of about 3,141 (218)

Morphogenesis of moss leaf-like organs through variations in deeply shared developmental principles. [PDF]

Sci Adv
Lin W, Collet L, Mancini L, Deshpande M, Lane B, Lapointe BP, Bagniewska-Zadworna A, Routier-Kierzkowska AL, Smith RS, Coudert Y, Kierzkowski D.   +10 more
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Adhesion issues in flip-chip on organic modules

IEEE Transactions on Components and Packaging Technologies, 1999
Flip chip attach on organic carriers is a novel electronic packaging assembly method which provides advantages of high input/output (I/O) counts, electrical performance and thermal dissipation. In this structure, the flip chip device is attached to organic laminate with predeposited eutectic solder.
S.K. Tran, D.L. Questad, B.G. Sammakia
openaire   +1 more source

Flip chip organic substrate with metal column

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2003
Discusses the issue of stress induced from CTE mismatch between silicon and organic substrate in a flip-chip package. Although the use of underfill has greatly reduced the stress on the solder bump under die by holding the stretched substrate to silicon, the solder joints are still seeing high stress prior to the process.
J.J.D. Lan, J. Chang, P. Lu, K. Chen, null Yu-Po Wang, A.-J.M. Yang   +5 more
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The Flip Side of Flexibility in Organizations

2014
This study points out the flip side of adopting a highly flexible approach in organization aiming at the human resource team where high degree of flexibility does not only impact the organization’s performance but also impinge on an employee’s personal life.
Shalini Verma, Sneh Anand
openaire   +1 more source

Flip-Chip on Organic Carrier Assembly Evaluation

Pan Pacific Symposium, 2001
ABSTRACT Flip-chip integrated circuits on organic ball grid array (BGA) substrates are often the package of choice for new applications. Electrical performance advantages, board real estate savings, ease of assembly, and superior reliability account for the increasing popularity of flip-chip plastic BGAs.
Donald R. Banks, Scott M. Bahe, Michael D. Holcomb, Duy K. Le-Huu   +3 more
openaire   +1 more source

BGA Reliability of Large Organic Flip-Chip Carriers

Specialized and Legacy Electronics Manufacturing Conferences, 1998
ABSTRACT Flip-chip integrated circuits packaged on organic ball grid array (BGA) substrates have steadily gained in popularity in recent years. New applications with larger die and substrates, usually application specific integrated circuits (ASICs) or microprocessors, are under evaluation throughout the industry.
Rich Kern, Ronald Pofahl
openaire   +1 more source

Flip Chip on Organic Substrates

SMTA International, 1999
ABSTRACT The attachment of a flip chip of moderate size and pitch to an organic substrate has lost much of its mystique in recent years. A small but increasing number of companies, including several contract manufacturers, are establishing flip chip capabilities.
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Reliability of flip chip BGA package on organic substrate

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2002
In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.
null Eun-Chul Ahn, null Tae-Je Cho, null Jong-Bo Shin, null Ho-Joong Moon, null Ju-Hyun Lyu, null Ki-Won Choi, null Sa-Yoon Kang, null Se-Yong Oh   +7 more
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Challenges of flip chip on organic substrate assembly technology

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 2003
Flip chip assembly on organic substrate technology has been developed and implemented as a key packaging technology for Intel's microprocessors for cost and performance advantages. In this paper, the process flow, key technology challenges and accomplishments achieved will be addressed.
V.K. Nagesh, R. Peddada, S. Ramalingam, B. Sur, A. Tai   +4 more
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Organic Flip Chip Packaging Design and Manufacturing Challenges

SMTA International, 2003
ABSTRACT Flip chip packaging has been practiced in the industry for over 30 years using ceramic substrates. This type of conventional flip chip package utilizes a Pb-rich solder bump that is attached to a multi-layered ceramic (MLC) substrate.
Louis Liu, Sid Wang, Sarathy Rajagopalan, Kishor V. Desai, Charles G. Woychik   +4 more
openaire   +1 more source