Results 161 to 170 of about 3,258 (217)
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Flip chip organic substrate with metal column
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2003Discusses the issue of stress induced from CTE mismatch between silicon and organic substrate in a flip-chip package. Although the use of underfill has greatly reduced the stress on the solder bump under die by holding the stretched substrate to silicon, the solder joints are still seeing high stress prior to the process.
J.J.D. Lan +5 more
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Flip-Chip on Organic Carrier Assembly Evaluation
Pan Pacific Symposium, 2001ABSTRACT Flip-chip integrated circuits on organic ball grid array (BGA) substrates are often the package of choice for new applications. Electrical performance advantages, board real estate savings, ease of assembly, and superior reliability account for the increasing popularity of flip-chip plastic BGAs.
Donald R. Banks +3 more
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The Flip Side of Flexibility in Organizations
2014This study points out the flip side of adopting a highly flexible approach in organization aiming at the human resource team where high degree of flexibility does not only impact the organization’s performance but also impinge on an employee’s personal life.
Shalini Verma, Sneh Anand
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Adhesion issues in flip-chip on organic modules
IEEE Transactions on Components and Packaging Technologies, 1999Flip chip attach on organic carriers is a novel electronic packaging assembly method which provides advantages of high input/output (I/O) counts, electrical performance and thermal dissipation. In this structure, the flip chip device is attached to organic laminate with predeposited eutectic solder.
S.K. Tran, D.L. Questad, B.G. Sammakia
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Flip Chip on Organic Substrates
SMTA International, 1999ABSTRACT The attachment of a flip chip of moderate size and pitch to an organic substrate has lost much of its mystique in recent years. A small but increasing number of companies, including several contract manufacturers, are establishing flip chip capabilities.
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Organic Flip Chip Packaging Design and Manufacturing Challenges
SMTA International, 2003ABSTRACT Flip chip packaging has been practiced in the industry for over 30 years using ceramic substrates. This type of conventional flip chip package utilizes a Pb-rich solder bump that is attached to a multi-layered ceramic (MLC) substrate.
Louis Liu +4 more
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Flip chip soldering and adhesive bonding on organic substrates
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 1995Flip chip interconnections to organic substrates were realized using different techniques: soldering using mechanical solder ball bumps and adhesive bonding with isotropic conductive adhesive. Both approaches use an electrolessly deposited nickel-gold under bump metallization.
E. Jung +4 more
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BGA Reliability of Large Organic Flip-Chip Carriers
Specialized and Legacy Electronics Manufacturing Conferences, 1998ABSTRACT Flip-chip integrated circuits packaged on organic ball grid array (BGA) substrates have steadily gained in popularity in recent years. New applications with larger die and substrates, usually application specific integrated circuits (ASICs) or microprocessors, are under evaluation throughout the industry.
Rich Kern, Ronald Pofahl
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Reliability of flip chip BGA package on organic substrate
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2002In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.
null Eun-Chul Ahn +7 more
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