Results 121 to 130 of about 21,585 (298)

Trans-floating-point arithmetic removes nine quadrillion redundancies from 64-bit IEEE 754 floating-point arithmetic

open access: yes, 2014
IEEE 754 floating-point arithmetic is widely used in modern, general-purpose computers. It is based on real arithmetic and is made total by adding both a positive and a negative infinity, a negative zero, and many Not-a-Number (NaN) states.
James Anderson (516164)   +1 more
core   +1 more source

Influence of Scan Strategies in Electron Beam Powder Bed Fusion on Solidification, Microstructure, and High‐Temperature Compressive Properties of γ′‐Strengthened Inconel 738LC

open access: yesAdvanced Engineering Materials, EarlyView.
Experiments and thermophysical simulations were conducted to investigate the electron beam powder bed fusion electron beam (PBF‐EB/M) process for the γ′‐strengthened nickel‐based superalloy Inconel 738LC. The results demonstrate the impact of process‐induced microstructural variations on high‐temperature mechanical behavior, providing a basis for ...
Jan Niklas Petenati   +11 more
wiley   +1 more source

Floating-point hardware designs for multumedia processing

open access: yes, 2009
TEZ7368Tez (Doktora) -- Çukurova Üniversitesi, Adana, 2009.Kaynakça (s.101-105) var.viii, 106 s. ; 29 cm.In this dissertation floating-point arithmetic circuits for multimedia processing are designed.
Özbilen, Metin Mete
core  

Hybrid Metal–Carbon Ink for Printed Stretchable Temperature Sensors

open access: yesAdvanced Engineering Materials, EarlyView.
We prepare conductive inks for temperature sensing with silver flakes and carbon or graphite flakes in a silicone elastomer matrix. Silver dominates the temperature‐dependent conductivity, while the carbon filler network ensures the stability of the conductive pathways and retains function under strain.
Makara Lay   +3 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

Checking Compatibility of Bit Sizes in Floating Point Comparison Operations

open access: yes, 2012
We motivate, define and design a simple static analysis to check that comparisons of floating point values use compatible bit widths and thus compatible precision ranges.
Fähndrich, Manuel   +3 more
core   +1 more source

From Food to Power: Hydrogel Thermoelectrics for Ingestible Electronics

open access: yesAdvanced Functional Materials, EarlyView.
We introduce a fully edible thermoelectric–electrochromic platform that harvests heat from food and converts it into a visible color change. N‐type and p‐type hydrogel thermoelectric generators connected in series power anthocyanin‐based electrochromic displays, demonstrating the feasibility of safe, biodegradable, ingestible systems for on‐food ...
Antonia Georgopoulou   +3 more
wiley   +1 more source

The feasibility of speeding up 2D seismic migration using a specific processor on a FPGA

open access: yesIngeniería e Investigación, 2010
This paper was aimed at describing the state of the art regarding 2D migration from a software and hardware perspective. It also gives the current state of specific processing using field programmable gate array (FPGA) and then concludes with the ...
Sergio Alberto Abreo Carrillo   +1 more
doaj  

Floating-Point Verification

open access: yes, 2007
This paper overviews the application of formal verification techniques to hardware ingeneral, and to floating-point hardware in particular. A specific challenge is to connect the usual mathematical view of continuous arithmetic operations with the ...
Harrison, John, Harrison,John
core   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

open access: yesAdvanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa   +19 more
wiley   +1 more source

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