Results 271 to 280 of about 161,061 (357)

Influence of a Standard Heat Treatment on the Microstructure and Properties of Inconel X‐750 Produced by Laser Powder Bed Fusion

open access: yesAdvanced Engineering Materials, EarlyView.
Ni‐base superalloys produced using additive manufacturing (AM) have a different response to heat treatments when compared to their conventional counterparts. Due to such unpredictability, various alloys with industrial interest are currently overlooked in most prior AM research.
Guilherme Maziero Volpato   +6 more
wiley   +1 more source

A Comprehensive Review of Additive Manufacturing for Space Applications: Materials, Advances, Challenges, and Future Directions

open access: yesAdvanced Engineering Materials, EarlyView.
Additive manufacturing (AM) transforms space hardware by enabling lightweight, high‐performance, and on‐demand production. This review outlines AM processes—powder bed fusion (PBF), directed energy deposition (DED), binder jetting (BJ), sheet lamination (SL), and material extrusion (ME)—applied to propulsion, satellite structures, and thermal devices ...
Stelios K. Georgantzinos   +8 more
wiley   +1 more source

Magnetoactive Metamaterials: A State‐of‐the‐Art Review

open access: yesAdvanced Engineering Materials, EarlyView.
Magnetoactive metamaterials combine magnetoactive composites with architected metastructures to enable contactless, tunable control of mechanical, acoustic, and elastic properties. This review highlights recent advances in their design, fabrication, and applications in soft robotics, biomedical devices, and adaptive structures and outlines future ...
Seyyedmohammad Aghamiri, Ramin Sedaghati
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

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