Results 231 to 240 of about 1,137,186 (301)

Recent Advances of Slip Sensors for Smart Robotics

Advanced Materials Technologies, EarlyView.
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang, Liao Wu, Shuai He, Zhao Sha, Yuwan Huang, Shuying Wu, Dewei Chu, Chun H. Wang, Shuhua Peng   +8 more
wiley   +1 more source

Flash droughts threaten global managed forests. [PDF]

Nat Commun
Pang J, Xu H, Xu Y, Zhang Y, Wu X, Li K, Zhang Z.   +6 more
europepmc   +1 more source

Hydrogel‐Based Functional Materials: Classifications, Properties, and Applications

Advanced Materials Technologies, EarlyView.
Conductive hydrogels have emerged as promising materials for smart wearable devices due to their outstanding flexibility, multifunctionality, and biocompatibility. This review systematically summarizes recent progress in their design strategies, focusing on monomer systems and conductive components, and highlights key multifunctional properties such as
Zeyu Zhang, Zao Cheng, Patrizio Raffa
wiley   +1 more source

Diameter Class-Dependent Species-Specific Tree-Soil Feedback Linked to Soil Quality Between <i>Cunninghamia lanceolata</i> (Lamb.) Hook. and <i>Quercus fabri</i> Hance in Subtropical Forests. [PDF]

Plants (Basel)
Lei G, Yang Y, Li W, Chen T, Qi L.
europepmc   +1 more source

Forest Values, Forest Service

, 2014
openaire   +2 more sources

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

Advanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco, Nicola Larovere, Antonio Zagaria, Antonio Pavone, Rosanna Rifino, Gianni Stano   +5 more
wiley   +1 more source

Expansion of Moso bamboo into Chinese fir stands persistently depletes rhizosphere bioavailable P pools: a seasonal, space-for-time approach. [PDF]

Front Plant Sci
Bi S, Shi X, Peng C, Hu T, Chen J, Xie J, Li H, Cao T, Shi M, Wang Z, Li Q, Song X.   +11 more
europepmc   +1 more source

Adhesive Double‐Network Granular Organogel E‐Skin

Advanced Materials Technologies, EarlyView.
We introduce a double‐network granular organogel adhesive for electronic skin, overcoming adhesion and strength trade‐offs. It provides reversible, robust bonding and ionic conductivity, enabling wearable and soft robotic e‐skin. Thanks to the e‐skin adhesive, a soft robotic trunk can recognize touch, temperature, humidity, and acidity.
Antonia Georgopoulou, Benhui Dai, Kadence Shen Yu Chow, Josie Hughes, Esther Amstad   +4 more
wiley   +1 more source

Associations of Biotic and Abiotic Factors with Phylogenetic Community Structure Across Temperate Forests in South Korea. [PDF]

Biology (Basel)
Lee CB.
europepmc   +1 more source