Results 131 to 140 of about 981,951 (245)

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

Development and Preliminary In Vivo Study of 3D‐Printed Bioactive Glass Scaffolds with Trabecular Architecture

open access: yesAdvanced Engineering Materials, EarlyView.
This study reports the fabrication of trabecular bioactive glass scaffolds (composition “1d”: 46.1SiO2‐28.7CaO‐8.8MgO‐6.2P2O5‐5.7CaF2‐4.5Na2O wt%) through vat photopolymerization and the relevant results from mechanical testing and in vivo implantation procedures in rabbit femora, showing great promise for bone tissue engineering applications.
Dilshat Tulyaganov   +8 more
wiley   +1 more source

Heterostructure‐Specific Toughening Mechanisms in Metallic Laminates

open access: yesAdvanced Engineering Materials, EarlyView.
This study highlights how various aspects of the heterostructural design of metallic laminates can be specifically tailored to achieve improved fracture resistance for damage‐tolerant designs of cyclically stressed components. Based on results from in situ fatigue crack growth tests, a comprehensive overview of the formation and development of ...
Philip Manuel Pohl   +5 more
wiley   +1 more source

Encapsulating Laser‐Induced Graphene to Preserve its Electrical Properties and Enhance its Mechanical Robustness

open access: yesAdvanced Engineering Materials, EarlyView.
It is demonstrated that laser‐induced graphene (LIG) can be encapsulated while preserving its electrical conductivity and enhancing its mechanical properties. Unlike previous encapsulation attempts, the optimal conditions described here result in sheet resistance of ≈2 Ω sq−1, resistance increase of only 5% upon encapsulation, and vastly improved ...
Fatemeh Bayat   +3 more
wiley   +1 more source

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