Results 101 to 110 of about 184,718 (304)
Advanced Materials Interfaces, EarlyView.SAA significantly enhanced Al/PU bonding, increasing SLSS by up to 920% and fracture energy by 15 100% through optimized micro‐nano porous surfaces. RSM identified the optimal anodizing conditions, while ML confirmed sulfuric acid concentration and roughness as dominant predictors of strength.
Umut Bakhbergen +6 more
wiley +1 more source
Advanced Materials Technologies, EarlyView.The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
wiley +1 more source
ANALYSIS ON THE FATIGUE FRACTURE CHARACTERISTICS OF COMPOSITE INSULATOR CORE ROD
Jixie qiangdu, 2018 In order to analyze the fatigue fracture surface characteristics of composite insulator core rod, the fatigue damage process of insulators under different amplitude/torsion angle conditions was simulated by dynamic load fatigue test.
ZHAO XinZe +4 more
doaj
Advanced Materials Technologies, EarlyView.Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya +2 more
wiley +1 more source
Fatigue strength and durability analysis by normalised equivalent stress functionals [PDF]
, 2003 Generalised fatigue durability diagrams are considered for a material under multi-axial loading given by a (non-regularly) oscillating function of time.
Mikhailov, SE, Namestnikova, IV
core +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits
Advanced Materials Technologies, EarlyView.A cleanroom‐free fabrication strategy combines UV‐laser micromachining with a copper foil wetting layer to rapidly produce high resolution, liquid metal based stretchable electronic circuits on diverse substrates. The scalable, maskless process enables complex circuit designs (<$<$3 h, ∼$\sim$15/device) with excellent electrical stability under strain,
Merjen Palvanova +3 more
wiley +1 more source
Advanced Materials Technologies, EarlyView.This review outlines how understanding bone's biology, hierarchical architecture, and mechanical anisotropy informs the design of lattice structures that replicate bone morphology and mechanical behavior. Additive manufacturing enables the fabrication of orthopedic implants that incorporate such structures using a range of engineering materials ...
Stylianos Kechagias +4 more
wiley +1 more source
eXPRESS Polymer LettersHigh-performance polymers are extensively used in various applications undergoing long-term cyclic loadings. The deformation behaviour of an amorphous thermoset epoxy resin undergoing cyclic compressive loading is investigated for a range of applied ...
Jingwei Yu +4 more
doaj +1 more source
A compendium of sources of fracture toughness and fatigue crack growth data for metallic alloys, part 4 [PDF]
A collection of sources is presented of fracture toughness and fatigue crack growth data for metallic ...
Ferrainolo, John J., Hudson, C. Michael
core +1 more source