Study on Fatigue Behavior and Fracture Mechanism of LMD Ti-6.5Al-3.5Mo-1.5Zr-0.3Si Alloy Based on Microstructure. [PDF]
Wu Y, Wang Y, Lu Y, Zhao C.
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Ultrathin AlOxHy interlayers between aluminum films and polymer substrates significantly improve electro‐mechanical properties of flexible thin film systems. By precisely controlling interlayer thickness using atomic layer deposition, this study identifies an optimal interlayer thickness of 5–10 nm that enhances ductility and delays cracking.
Johanna Byloff +9 more
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Macro-micro fracture mechanism and acoustic emission characteristics of brittle rock induced by loading rate effect. [PDF]
Cheng Y +9 more
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Experimental and Numerical Evaluation on Deformation and Fracture Mechanism of Cast Duplex Stainless Steel Tubular Specimen. [PDF]
Li Z +5 more
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Quasi‐Static to Supersonic Energy Absorption of Nanoarchitected Tubulanes and Schwarzites
Nanoarchitected energy‐absorptive Tubulanes exhibit record energy absorption under quasi‐static conditions and exceptional inelastic energy dissipation under 750 m s−1 ballistics impact, with high performance spanning strain rates of 12 orders of magnitude.
Peter Serles +16 more
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Study on rock fracture mechanism and hydraulic fracturing propagation law of heterogeneous tight sandstone reservoir. [PDF]
Zhao H +6 more
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Bio‐Inspired Molecular Events in Poly(Ionic Liquids)
Originating from dipolar and polar inter‐ and intra‐chain interactions of the building blocks, the topologies and morphologies of poly(ionic liquids) (PIL) govern their nano‐ and micro‐processibility. Modulating the interactions of cation‐anion pairs with aliphatic dipolar components enables the tunability of properties, facilitated by “bottom‐up ...
Jiahui Liu, Marek W. Urban
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Dynamic fracture mechanism and fragment characteristics of sandstone specimens with asymmetrical conjugate fissures under static pre-compression. [PDF]
Feng P, Cao P, Li J, Tang R, Li H.
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Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. [PDF]
Zhao D +5 more
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Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
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