Results 201 to 210 of about 2,075,851 (384)

Exploiting Geometric Frustration in Coupled von Mises Trusses to Program Multifunctional Mechanical Metamaterials

open access: yesAdvanced Engineering Materials, EarlyView.
Mechanical metamaterials capable of compressive stiffness tunability, shape morphing, and post‐fabrication modularity. Herein, the 3D unit cell design is based on an assembly of bistable von Mises trusses that exhibit a switch in compressive stiffness and resting height from one stable state to the other.
Yannis Liétard   +2 more
wiley   +1 more source

Dimensionless Investigations on Energy Conversion and Analysis of Interlayer Time in Laser‐Based Powder Bed Fusion of Polymers for Polyamide 12 with Nanoadditives and Polypropylene

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores the energy conversion in powder bed fusion of polymers using laser beam for polyamide 12 and polypropylene powders. It combines material and process data, using dimensionless parameters and numerical models, to enable the prediction of suitable printing parameters.
Christian Schlör   +9 more
wiley   +1 more source

Geometry‐Assisted Phase Selection: Interplay of Phase Heterogeneity and Geometry in Gyroid Shell Metamaterials Printed with 17‐4 PH Stainless Steel

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores geometry‐driven phase evolution in gyroid shell metamaterials made via laser powder bed fusion of 17‐4 precipitation hardened stainless steel. Locally hardened regions develop along the primary loading paths in the structure, which finite element analysis and geometric considerations link to enhanced gyroid strength.
Julia T. Pürstl   +8 more
wiley   +1 more source

Galar - a large multi-label video capsule endoscopy dataset. [PDF]

open access: yesSci Data
Le Floch M   +19 more
europepmc   +1 more source

Effect of Acrylic Structural Adhesive as a Joint Reinforcement on Film Deformation during the Thermoforming Process for In‐Mold Electronic Devices

open access: yesAdvanced Engineering Materials, EarlyView.
In‐mold electronics (IME) enables the integration of circuits into more complex scenarios, yet the key challenge remains ensuring a fully functional device. This study investigates how the presence of structural adhesives can improve the performance and functionality of IME devices, addressing key challenges in device integration.
Francisco Ituriel Arias‐García   +3 more
wiley   +1 more source

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