Results 141 to 150 of about 272,809 (292)

Opportunities for Multiscale Pattern Modulation with Temporally Arrested Breath Figures

Advanced Materials Interfaces, EarlyView.
This works presents the temporally arrested breath figure methodology and its opportunities for pattern modulation. Through thermodynamic and photochemical phase change handles, this method uses drop‐wise condensation as a dynamic template for fast, accessible and scalable micropatterning.
Francis J. Dent, Maximilian Dreisbach, Jochen Kriegseis, Alexander Stroh, Hiroshi Yabu, Sepideh Khodaparast   +5 more
wiley   +1 more source

Self‐Assembled Cobalt Oxide Nanobeads on the Conducting Van der Waals Semi‐Metal PtTe2 for Catalytic Heterostructure

Advanced Materials Interfaces, EarlyView.
Self‐assembled CoO nanobeads on the Van der Waals surface of PtTe2 were synthesized through simple thermal annealing utilizing the residual oxygen in the annealing chamber. In this study, the electrocatalytic effect for oxygen evolution reaction from CoO nanobeads on conducting PtTe2 was confirmed, elucidating the new pathway to design a ...
Minhyuk Choi, Hyeryeon Lee, Ki Chang Kwon, Seungwook Choi, Gyeongbo Kim, Nurul Hasanah, Ansoon Kim, Mun Seok Jeong, Eun Kyu Kim, Seungwoo Song   +9 more
wiley   +1 more source

Block identification and stability analysis of underground stope with multi-working face. [PDF]

PLoS One
Zhang M, Tie C, Wang B, Yang Y, Wang C, Sun W, Xia J, Zhou X.   +7 more
europepmc   +1 more source

Cr2AlC: A High‐Temperature Transparent Conducting Ceramic

Advanced Materials Interfaces, EarlyView.
The high‐quality epitaxial Cr2AlC(0001) layer combines a low resistivity of 42.5 µΩcm, 84% optical transmittance at 900 nm, and thermal stability up to 800–1100°C. It stands out as an excellent high‐temperature transparent conductor with a negligible resistivity size effect, exceptional scaling (ρoλ < 3 × 10−16 Ωm2), and a figure of merit of 0.004 Ω−1.
Baiwei Wang, Atharv Jog, Peijiao Fang, Sushant Kumar, Rui Shu, Jian Shi, Ravishankar Sundararaman, Daniel Gall   +7 more
wiley   +1 more source

Modified bentall surgery using a graft insertion technique for prosthetic valve endocarditis with left ventricular-aortic discontinuity: a case report. [PDF]

Gen Thorac Cardiovasc Surg Cases
Sakurahara D, Nakamura E, Mori K, Furukawa K.   +3 more
europepmc   +1 more source

Multimodal Imaging of Strain and Light Emission of Core–Shell InGaN/GaN Wires under a Sub‐Micrometer Polychromatic X‐Ray Probe

Advanced Materials Interfaces, EarlyView.
Micro‐Laue diffraction and excited optical X‐ray luminescence are used to study InGaN/GaN core‐shell wires on the BM32 beamline at the European Synchrotron. Multimodal imaging of X‐ray fluorescence, deviatoric strain tensors and optical emissions is performed using simultaneous mapping.
Beatriz de Goes Foschiani, Sergio Bongiorno, Odile Robach, Olivier Ulrich, Jean‐Sébastien Micha, Joël Eymery   +5 more
wiley   +1 more source

Acetabular Distraction and the Cup-in-Cup Technique for the Management of Pelvic Discontinuity: A Case Report. [PDF]

Cureus
Ponce de Leon Sandoval IA, Soriano Solís HA, Herce Santisteban A, Kerbel Sutton J, González Ugalde H.   +4 more
europepmc   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

Advanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz, Yaroslav Mudryk, Jun Cui, Lucas Griffith, Duane D. Johnson, Julie Slaughter   +5 more
wiley   +1 more source

Vaccination and Risk Aversion: Evidence From a Flu Vaccination Campaign. [PDF]

Health Econ
Garrouste C, Juet A, Samson AL.
europepmc   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source