Results 251 to 260 of about 6,849,681 (296)

Wafer‐Scale 3D Integration for High‐Density Multi‐Valued Neuromorphic Logic

open access: yesAdvanced Science, EarlyView.
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Chang‐Hyeon Kim   +5 more
wiley   +1 more source

Atomistic Kinetics of Dislocation‐Mediated Grain Growth in Monolayer MoS2

open access: yesAdvanced Science, EarlyView.
Atomic‐resolution in‐situ heating microscopy directly visualizes dislocation‐mediated grain boundary migration and grain growth in monolayer MoS2. Mobile grain boundaries migrate through collective motion of Mo 5|7 dislocations, whereas S 5|7 defects remain largely immobile.
Chang‐Won Choi   +11 more
wiley   +1 more source

Terahertz Channel Modeling, Estimation and Localization in RIS‐Assisted Systems

open access: yesAdvanced Electronic Materials, EarlyView.
Reconfigurable intelligent surfaces have become a recent intensive research focus. Based on practical applications, channel strategies for RIS‐assisted terahertz wireless communication systems are categorized into three different types: channel modeling, channel estimation, and channel localization.
Hongjing Wang   +9 more
wiley   +1 more source

UCTLFANet: a low-rank fine-tuning model for microalgae image segmentation. [PDF]

open access: yesSci Rep
Liu Z   +10 more
europepmc   +1 more source

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