Solution‐Processable Polymer Nanocomposites for Electromagnetic Interference Shielding
Advanced Materials Interfaces, EarlyView.This review introduces scalable strategies for fabricating solution‐processable polymer nanocomposites with improved electromagnetic interference (EMI) shielding performance. It compares three fabrication methods, including solution blending, in situ polymerization, and Pickering emulsion polymerization, and highlights their respective advantages in ...
Tuan Sang Tran +3 more
wiley +1 more source
Effect of Extrusion Parameters on Short Fiber Alignment in Fused Filament Fabrication [PDF]
, 2021 Patrick Consul +3 more
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Reconfigurable Soft Actuators Constructed via Layer‐by‐layer Assembly
Advanced Materials Interfaces, EarlyView.Stimulated by the energy inputs from heating or humidifying, structural reconfigurations took place in two different materials as manifested by the dynamic structures and mechanical performance, leading to the opportunities of self‐healing and welding. Based on the hierarchical assembly of these two materials with complementary properties, an actuator ...
Qing Chen +11 more
wiley +1 more source
Preliminary Finite Element Analysis and Flight Simulations of a Modular Drone Built through Fused Filament Fabrication [PDF]
, 2021 Salvatore Brischetto, Roberto Torre
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3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby +5 more
wiley +1 more source
3D Printing of Polyamide to Fabricate a Non-Metal Clasp Removable Partial Denture via Fused Filament Fabrication: A Case Report [PDF]
, 2021 Sebastian Spintzyk +4 more
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Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
An Investigation of in Fill Process Variables to Reduce Warpage in Fused Filament Fabrication [PDF]
, 2021 Pranav Addepalli
openalex +1 more source