Results 191 to 200 of about 47,758 (263)

Additively Manufactured Porous Ceramics as Tunable Dielectrics for Passive Temperature Sensing

open access: yesAdvanced Materials Technologies, EarlyView.
Porous ceramic lattices, 3D‐printed from a multicomponent oxide ink, are integrated with LC resonators for passive wireless temperature sensing. By tuning porosity, the dielectric properties and RF response are engineered to produce distinct resonant frequency shifts with temperature. The results establish a structure‐driven approach to customizing the
Sogol Heidarishahrivar   +5 more
wiley   +1 more source

Additive Manufacturing of Patient‐Specific Intracranial Aneurysm Cell Culture Models

open access: yesAdvanced Materials Technologies, EarlyView.
Patient‐specific intracranial aneurysm models were fabricated using chocolate moulding, 3D printed water‐soluble cores, and direct resin 3D printing. Moulding PDMS around sacrificial cores made of chocolate or 3D printed water‐soluble resin yielded accurate, expandable, and endothelializable models that outperformed resin‐based approaches.
Chloe M. de Nys   +6 more
wiley   +1 more source

Additive‐Manufactured, Multifunctional Bioreactor Technology for Dynamic Culture of 3D Bioprinted Tissue Models

open access: yesAdvanced Materials Technologies, EarlyView.
We introduce an additively manufactured bioreactor with a perfusion flow system and integrated temperature and pH sensors for skeletal muscle tissue biofabrication. The bioreactor's performance was evaluated by assessing the viability, spreading of the myoblast cells in a printed scaffold, and contraction of the isolated murine musculi interossei ...
Lys Sprenger   +9 more
wiley   +1 more source

Morphology‐Driven Electromechanical Performance of Graphene‐Based Electrofluids for Emerging Soft Electronic Systems

open access: yesAdvanced Materials Technologies, EarlyView.
Here, two types of electronic components are presented: a strain sensor and a stable resistor. Electrofluids properties are tuned to match these behaviors by selecting the type of filler. We show that the morphology of the filler together with its oxygen content are the key parameters to create electrical and mechanical networks with distinct responses.
Dominik S. Schmidt   +4 more
wiley   +1 more source

Shaping Carbon Nitrides for Advanced Macrostructures

open access: yesAdvanced Materials Technologies, EarlyView.
This review examines how carbon nitride can be shaped through a range of printing and interfacial assembly methods. By bringing together additive manufacturing and liquid–liquid structuring concepts, carbon nitride is moving beyond its traditional powder‐based photocatalyst form toward digitally designed robust macroscale architectures with high design
Simona Baluchová, Baris Kumru
wiley   +1 more source

Coupling of Er3+ ions and Plasmonic Modes in Vertical Nanocavities for Spectral Broadening in Telecom Bands

open access: yesAdvanced Materials Technologies, EarlyView.
Left: Illustration of the glass & nanostructures system and the NIR emission at 1.5 µm, where the colored spheres represent the Er3+ ions within the doped glass. Right: Representation of the Stark splitting of the 4I13/2 and 4I15/2 manifolds of the Er3+, illustrating how the plasmonic modes facilitate the emission from the broader Stark manifold ...
Gaston Lozano Calderón   +5 more
wiley   +1 more source

Aluminum Oxynitride‐Engineered Transparent Aluminum Nitride Resistive Memory for Low‐Leakage Multilevel Switching in Micro‐LED Pixels

open access: yesAdvanced Materials Technologies, EarlyView.
An AlON interfacial layer is engineered within an AlN switching layer to enable transparent RRAM with four stable resistance states. The device achieves low‐voltage multilevel switching and a high HRS, allowing precise grayscale modulation and preventing light leakage in micro‐LEDs operated at VDD = 2.7 V.
Sung Keun Choi   +7 more
wiley   +1 more source

Solid Particle‐Liquid Metal Mixtures for Robust High‐Current Interconnects in Stretchable Electronics and Soft Robotics

open access: yesAdvanced Materials Technologies, EarlyView.
Metallic microparticles dispersed in liquid metal interconnects mitigate electromigration‐induced failure by reconfiguring internal current density distributions. These fillers facilitate the growth of a robust, protective gallium oxide shell at elevated temperatures, shifting the failure threshold toward a thermal limit.
Ethan J. Krings   +6 more
wiley   +1 more source

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