Results 241 to 250 of about 6,349,849 (305)

A Dual‐Functional Nanoplatform Targeting the dsDNA–cGAS Axis to Mitigate Disc Degeneration and Aberrant Innervation

open access: yesAdvanced Science, EarlyView.
RU@PEI‐ZIF integrates dsDNA scavenging with local cGAS inhibition to suppress the dsDNA–cGAS–STING/Netrin‐1 axis in intervertebral disc degeneration. By attenuating nucleus pulposus cell senescence, inflammatory and matrix‐catabolic responses, and pathological sensory innervation, this dual‐functional nanoplatform preserves disc integrity and reduces ...
Zhaojun He   +12 more
wiley   +1 more source

Hybrid Spring‐Coupled Broadband Energy Harvester Integrated with CuSCN Functionalized Triboelectric Vibration Sensor for Self‐Sustainable Vehicular IoTs

open access: yesAdvanced Science, EarlyView.
A self‐sustainable vehicular vibration and indoor environment monitoring IoT platform is developed which integrates a hybrid spring‐coupled broadband energy harvester with a machine learning‐assisted PAN‐CuSCN nanofiber triboelectric vibration sensor for subtle‐to‐wide‐range vibration detection and road/speed classification.
Trilochan Bhatta   +6 more
wiley   +1 more source

Terahertz Channel Modeling, Estimation and Localization in RIS‐Assisted Systems

open access: yesAdvanced Electronic Materials, EarlyView.
Reconfigurable intelligent surfaces have become a recent intensive research focus. Based on practical applications, channel strategies for RIS‐assisted terahertz wireless communication systems are categorized into three different types: channel modeling, channel estimation, and channel localization.
Hongjing Wang   +9 more
wiley   +1 more source

Emerging Memory and Device Technologies for Hardware‐Accelerated Model Training and Inference

open access: yesAdvanced Electronic Materials, EarlyView.
This review investigates the suitability of various emerging memory technologies as compute‐in‐memory hardware for artificial intelligence (AI) applications. Distinct requirements for training‐ and inference‐centric computing are discussed, spanning device physics, materials, and system integration.
Yoonho Cho   +6 more
wiley   +1 more source

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