Results 241 to 250 of about 1,406,596 (298)
Enhanced mechanical and thermal properties of polyester/glass/sheep wool fiber hybrid composites by successful replacement glass with wool. [PDF]
Sadroddini M.
europepmc +1 more source
This study demonstrates that the dual delivery of BMP‐2/‐7 coding cmRNAs for bone healing is demonstrated as feasible, safe, and highly osteogenic. Compared to single BMP‐2 or BMP‐7 cmRNAs, the combination enhances the production of both mineral and organic components of the extracellular matrix when delivered using a collagen‐HA scaffold, supporting ...
Claudia Del Toro Runzer +7 more
wiley +1 more source
Sustainable Hybrid Laminated Composites Reinforced with Bamboo, Flex Banner, and Glass Fibers: Impact of CaCO<sub>3</sub> Filler on Mechanical Properties. [PDF]
Widodo RD +5 more
europepmc +1 more source
Biomass Native Structure Into Functional Carbon‐Based Catalysts for Fenton‐Like Reactions
This study indicates that eight biomasses with 2D flaky and 1D acicular structures influence surface O types, morphology, defects, N doping, sp2 C, and Co nanoparticles loading in three series of carbon, N‐doped carbon, and cobalt/graphitic carbon. This work identifies how these structural factors impact catalytic pathways, enhancing selective electron
Wenjie Tian +7 more
wiley +1 more source
Comparative Study of Nanocrystalline Dysprosium Oxide Thin Films Deposited on Quartz Glass and Sapphire Substrates by Means of Electron Beam. [PDF]
Alresheedi F.
europepmc +1 more source
MECHANICAL PROPERTIES OF GLASS FIBER AND CARBON FIBER REINFORCED COMPOSITES
Nadtochii Yurii
openalex +1 more source
The dielectric properties of clays are studied on the level of individual monolayers and functional double stacks. The material breakdown characteristics and charge storage performance are analyzed. For illustration, a defined charge pattern representing a cuneiform character is produced, written into a microscopic clay tile, referencing the origins of
Sebastian Gödrich +6 more
wiley +1 more source
Wafer-level self-packaged MEMS infrared emitters with high-emissivity black silicon surface. [PDF]
Li Z, Zu H, Chen H, Liu M, San H, Yu D.
europepmc +1 more source

