Results 191 to 200 of about 36,679 (341)

Beyond Order: Perspectives on Leveraging Machine Learning for Disordered Materials

open access: yesAdvanced Engineering Materials, EarlyView.
This article explores how machine learning (ML) revolutionizes the study and design of disordered materials by uncovering hidden patterns, predicting properties, and optimizing multiscale structures. It highlights key advancements, including generative models, graph neural networks, and hybrid ML‐physics methods, addressing challenges like data ...
Hamidreza Yazdani Sarvestani   +4 more
wiley   +1 more source

Low‐Activation Compositionally Complex Alloys for Advanced Nuclear Applications—A Review

open access: yesAdvanced Engineering Materials, EarlyView.
Low‐activation compositionally complex alloys (LACCAs) are advanced metallic materials primarily composed of low‐activation elements, offering advantages such as rapid compliance with operational standards and safe recyclability. This review highlights their potential for extreme high‐temperature irradiation environments as structural materials for ...
Yangfan Wang   +8 more
wiley   +1 more source

Multimaterial Approach to Improve the Mechanical Properties of a Novel Modified Auxetic Reentrant Honeycomb Structure

open access: yesAdvanced Engineering Materials, EarlyView.
A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel   +2 more
wiley   +1 more source

The Distribution of Stars in Globular Clusters [PDF]

open access: yesMonthly Notices of the Royal Astronomical Society, 1915
openaire   +2 more sources

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

Home - About - Disclaimer - Privacy