Results 101 to 110 of about 14,656 (205)
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications [PDF]
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study.
Chun, H. -S. +3 more
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Electrochemical reactions have been extensively studied and used in various fundamental research and engineering applications such as electroplating, surface treatment, secondary batteries, and fuel cells because they are scalable, economically viable ...
Shunya Saegusa +5 more
doaj +1 more source
Investigation of the Effective Parameters on the Cyanide Fate in Soil [PDF]
Natural degradation of cyanide is one of the oldest methods used to remove the cyanide present in industrial wastewater of electroplating and extraction processes in gold and silver industries.
Alireza Zadeh Bafghi +2 more
doaj
CdS solar cell development Interim technical report [PDF]
Cadmium sulfide solar cell design ...
Bower, W. K. +2 more
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Gold-platinum alloy nanoparticles (AuPtNP) were electrochemically deposited on the surface of indium-tin-oxide (ITO) modified with (3-aminopropyl)triethoxysilane (APTES), after optimizing deposition conditions for the electroplating solution and number ...
Kalpana Ladi, Aditya Sharma Ghrera
doaj +1 more source
Surface treatments for nickel and nickel-base alloys [PDF]
Surface treatments of nickel and nickel alloys by diffusion coating, electroplating, explosive hardening, peening, and other ...
Hall, A. M., Jackson, C. M.
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Low Voltage Totally Free Flexible RF MEMS Switch With Anti-Stiction System
This paper concerns a new design of RF MEMS switch combined with an innovative process which enable low actuation voltage (
Kanciurzewski, Alexandre +6 more
core
Study of thin film large area photovoltaic solar energy converter First quarterly report, 25 Oct. 1965 - 24 Jan. 1966 [PDF]
Cadmium sulfide thin film photovoltaic cell for large area solar energy ...
Augustine, F. +3 more
core +1 more source
Ultra high speed image processing techniques [PDF]
Packaging techniques for ultra high speed image processing were developed. These techniques involve the development of a signal feedthrough technique through LSI/VLSI sapphire substrates.
Anthony, T. +4 more
core +1 more source

