Results 161 to 170 of about 14,656 (205)
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Inspection of electroplated gold

SPIE Proceedings, 2008
Two aspects of electroplated gold that are often inspected on are plating thickness, and verification of gold presence at desired regions. With the later, in-situ reporting is desired. In this work, 8 color spaces - RGB, rgb, I1I2I3, HSI, YUV, YIQ, XYZ, and Laaaba - were investigated to differentiate between regions with and without electroplated ...
T. W. Ng, F. Y. Yong
openaire   +1 more source

Electromigration of Electroplated Gold Interconnects

MRS Proceedings, 2005
AbstractElectromigration tests were performed on passivated electroplated Au four terminal Kelvin line structures using the conventional in situ resistance monitoring technique. The stress conditions were a current density of 2.0 MA/cm2 with ambient temperatures ranging from 325°C to 375°C.
Steve Kilgore   +4 more
openaire   +1 more source

Gold Electroplating A Brief Overview

Interdisciplinary Science Reviews, 1992
Although the first gold electroplating was achieved almost 200 years ago, the process has taken off only during the past decade when the electronics industry began to use about 110 t/year of gold for this purpose. The principles and industrial mass production techniques are outlined and current developments, for example in hip and shoulder joint ...
C. Bocking, I. R. Christie
openaire   +1 more source

Carbon Inclusion in Gold Electroplate

Transactions of the IMF, 1972
SummaryUsing a radiotracer technique, a study has been made of the codeposition of carbon, originating as cyanide, in gold electroplated from an acid citrate bath. The amount of carbon codeposited is substantially increased when cobalt is used as a brightener (0–2 mg C/g Au in pure electroplate and 2·5 mg C/g Au in cobalt brightened electroplate).
L. Holt, J. Stanyer
openaire   +1 more source

The Lubrication of Steel by Electroplated Gold

A S L E Transactions, 1967
Sliding friction between an 1/8 in. spherical steel rider and a gold-plated steel flat was measured for various loads (200–2000 gm), gold film thicknesses (0.1–10 μ) and steel combinations (440C and 52100). Coefficient of friction recorded in each run for 100 traverses was found to be most sensitive to the rider material (0.1–0.3 with 440C rider and 0 ...
Riitsu Takagi, Tung Liu
openaire   +1 more source

Wear of electroplated gold-based coatings

Physical Mesomechanics, 2016
Deformation and fracture of electroplated Au-Ni coatings subjected to tribological testing under dry conditions were studied. Wear of the coatings is shown to result from macroscopic contact interaction of the specimen with the counterbody, and from abrasive action of microasperities on the counterbody surface and wear particles.
A. R. Shugurov   +3 more
openaire   +1 more source

Electromigration Reliability of Electroplated Gold Interconnects

MRS Proceedings, 2014
ABSTRACTThe electromigration lifetimes of a very large quantity of passivated electroplated Au interconnects were measured utilizing high-resolution in-situ resistance monitoring equipment. Application of moderate accelerated stress conditions with current density limited to 2 MA/cm2 and oven temperatures in the range of 300°C to 375°C prevented large ...
Steve H. Kilgore, Dieter K. Schroder
openaire   +1 more source

On selective electroplating of gold in fabrication of MIC's

Microelectronics Reliability, 1981
Abstract The analysis of the reasons causing degradation observed in resist layer during selective gold plating on patterns for MIC's has resulted in an excellent combination of electrolytic bath and photoresist type. Thick layers of gold (i.e. more than 10 μm) have been deposited by the method presented here over a period of about 1 h without any ...
S. Ahmad, M. Mustafa, J. Akhtar
openaire   +1 more source

Modern techniques for electroplating gold contacts

Thin Solid Films, 1982
Abstract Modern technology has introduced many new concepts to electroplating that make possible high speed selective plating on a continuous moving strip in a reel-to-reel plating machine. In this paper the new concepts are discussed which have led to higher processing speeds, more precise selective gold plating of contacts, better process control ...
openaire   +1 more source

Gold Electroplating

2009
VICENZO, ANTONELLO   +1 more
openaire   +3 more sources

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