Results 61 to 70 of about 14,656 (205)
Modular Electronic Microrobots With Onboard Sensor‐Program‐Steered Locomotion
Advanced Intelligent Systems, EarlyView.Modular electronic smartlet microrobots integrate ambient‐light energy harvesting, photodetection, programmable CMOS control, and bubble‐based actuation within a sub‐millimeter fold‐up architecture. A 58‐bit on‐board CMOS chiplet enables sensor–program steered switching between independently addressable actuators, achieving closed‐loop 2D navigation in
Vineeth K. Bandari +6 more
wiley +1 more source
Applied Sciences, 2018 Single-shot grating-based phase-contrast imaging techniques offer additional contrast modalities based on the refraction and scattering of X-rays in a robust and versatile configuration.
Margarita Zakharova +6 more
doaj +1 more source
Advanced Materials Interfaces, 2023 Microelectrode surfaces covered with nanostructures derived from components of extracellular matrix, such as collagen fibers, have shown immense beneficial effects in promoting neuronal growth and cellular signaling.
Bharat Nowduri +6 more
doaj +1 more source
Business Strategy and the Environment, EarlyView.ABSTRACT Digital transformation (DT) is increasingly recognised as essential for improving environmental performance in process‐intensive and hazardous sectors; however, the mechanisms by which digitalisation translates into green operational performance (GOP) and environmental accountability remain insufficiently investigated, particularly in ...
Amila Kasun Sampath Udage Kankanamge +2 more
wiley +1 more source
Laterally stacked Schottky diodes for infrared sensor applications [PDF]
, 1991 Laterally stacked Schottky diodes for infrared sensor applications are fabricated utilizing porous silicon having pores. A Schottky metal contract is formed in the pores, such as by electroplating.
Lin, True-Lon
core +1 more source
Thermosonic flip chip interconnection using electroplated copper column arrays
, 2006 Published ...
Gao, S, Holmes, AS
core +1 more source
A review of stencil printing for microelectronic packaging [PDF]
, 2012 PurposeThe purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.Design/methodology/approachThis paper gives a thorough review of stencil printing for electronic packaging including ...
Desmulliez, Marc, Kay, Robert
core +1 more source
EcoEnergy, EarlyView.This review provides a comprehensive overview of recent advances in glycerol electro‐oxidation reaction, covering electrocatalyst design, electrolyte and operating optimization, and mechanistic understanding of reaction pathways. Integrated anodic–cathodic systems and techno‐economic assessments are discussed, followed by key challenges and future ...
Jiamin Wang +3 more
wiley +1 more source
Technology for 3D System Integration for Flexible Wireless Biomedical Applications
Micromachines, 2018 This paper presents a new 3D bottom-up packing technology for integrating a chip, an induction coil, and interconnections for flexible wireless biomedical applications.
Wen-Cheng Kuo, Chih-Wei Huang
doaj +1 more source
Flexible Micro Thermoelectric Generator based on Electroplated Bi2Te3 [PDF]
, 2008 We present and discuss the fabrication process and the performance of a flexible micro thermoelectric generator with electroplated Bi2Te3 thermocouples in a SU-8 mold.
Durrer, L. +3 more
core +1 more source