Results 141 to 150 of about 6,672,830 (309)
Hip Arthroscopy: An Emerging Gold Standard [PDF]
, 2007 Paul E. Beaulé +5 more
openalex +1 more source
Microscale 3D Printed Pillars and Porous Polymeric Structures: Manufacturability and Micromechanics
Advanced Engineering Materials, EarlyView.This work demonstrates how two‐photon polymerization enables the fabrication of microscale solid and porous structures from IP‐Q, IP‐S, and IP‐PDMS resins. Combining morphological and mechanical characterization, the study provides the first systematic insights into IP‐Q mechanics and reveals how processing parameters affect structure and stiffness ...
Aikaterini Isaakidou +12 more
wiley +1 more source
‘Gold Standard’ in Clinical Practice
Nepal Journal of Neuroscience, 2016 Mohan R Sharma
doaj +1 more source
Advanced Engineering Materials, EarlyView.Mesoporous bioactive glass nanoparticles (MBGNs) are investigated for bone regeneration given their remarkable structural and functional properties. MBGNs are functionalized with Mn and Cu and incorporated with quercetin, a natural flavonoid exhibiting antioxidant, anti‐inflammatory, and antimicrobial properties.
Giovanni Lo Bello +5 more
wiley +1 more source
Fall of the Global Gold Exchange Standard and the Formation of the Contemporary Free Gold Market
, 2021 Dariusz Eligiusz Staszczak
openalex +1 more source
Magnetoactive Metamaterials: A State‐of‐the‐Art Review
Advanced Engineering Materials, EarlyView.Magnetoactive metamaterials combine magnetoactive composites with architected metastructures to enable contactless, tunable control of mechanical, acoustic, and elastic properties. This review highlights recent advances in their design, fabrication, and applications in soft robotics, biomedical devices, and adaptive structures and outlines future ...
Seyyedmohammad Aghamiri, Ramin Sedaghati
wiley +1 more source
MCQA-Eval: Efficient Confidence Evaluation in NLG with Gold-Standard Correctness Labels [PDF]
Xiaoou Liu +5 more
openalex +1 more source
Advanced Engineering Materials, EarlyView.Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source