Results 221 to 230 of about 5,265,671 (332)
Advanced Engineering Materials, EarlyView.Ti‐6Al‐4V samples produced by laser‐powder bed fusion are tested for static and dynamic mechanical properties to systematically evaluate the effects of surface roughness and internal porosity when using productivity parameters. The most detrimental impact to fatigue is caused by surface roughness, lack of fusion and keyhole porosity in descending order.
Julian Emanuel Gunther Schulz +4 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.This study focuses on processing the titanium alloy Ti‐17 using wire arc directed energy deposition (waDED), with an emphasis on the microstructure and mechanical properties. The waDED typical heat‐affected zone banding is characterized and related to the local mechanical properties.
Alexander Wenda +7 more
wiley +1 more source
Microscale 3D Printed Pillars and Porous Polymeric Structures: Manufacturability and Micromechanics
Advanced Engineering Materials, EarlyView.This work demonstrates how two‐photon polymerization enables the fabrication of microscale solid and porous structures from IP‐Q, IP‐S, and IP‐PDMS resins. Combining morphological and mechanical characterization, the study provides the first systematic insights into IP‐Q mechanics and reveals how processing parameters affect structure and stiffness ...
Aikaterini Isaakidou +12 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.This study compares the mechanical properties of Inconel 718 with two newly developed compositionally complex alloys (CCAs). Inco‐like‐H alloy demonstrates significantly improved wear resistance, surface finish, and hardness, notably at high temperatures. This CCA requires no heat treatment and is well suited for additive manufacturing. Its performance
Laurent Peltier +3 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source