Results 171 to 180 of about 876,316 (293)

Intron editing of RISBZ1 confers thermotolerance for grain filling in rice. [PDF]

J Integr Plant Biol
Li L, Zhou L, Jiang H, Huang L, Ji K, Li Y, Yao Z, Li Z, Bao Y, Huang J, Wang M, Wang W, Zhang H, Chen S.   +13 more
europepmc   +1 more source

Advanced Manufacturing of Composite‐Based Systems for Energy Applications

Advanced Materials Technologies, EarlyView.
Advanced manufacturing enables the integration of polymers, ceramics, metal oxides, and composites into architected microstructures with tailored transport pathways. By coupling material selection, manufacturing strategy, and structural design, multifunctional energy systems can simultaneously improve electrochemical performance, thermal management ...
Sri Vaishnavi Thummalapalli, Dhanush Patil, Libin Yang, M. Taylor Sobczak, Anshul Kulkarni, Xiao Sun, Arunachalam Ramanathan, Tiantian Li, Ramaraja P. Ramasamy, Jason J. Locklin, Yanyu Chen, Xianqiao Wang, Arunachala Mada Kannan, Kenan Song   +13 more
wiley   +1 more source

Alternating Wetting and Drying Irrigation During Grain Filling Period Improves the Eating Quality and 2AP Content of Aromatic Rice. [PDF]

Plants (Basel)
Zhang Z, Li Q, Li G, Chen L, Xie X, Zeng Y.   +5 more
europepmc   +1 more source

High Throughput Aerosol Jet Printing to Operationalize High Aspect Ratio Patterning

Advanced Materials Technologies, EarlyView.
High‐throughput aerosol jet printing poses distinct limiting mechanisms to the printing process. These include rapidly changing ink chemistries, atomization instabilities, and liquid‐phase spreading. The combination of in‐line heating, process monitoring, and traditional optimization procedures enables rapid printing of high‐aspect‐ratio structures ...
Bella I. Guyll, Md Mahdi Ul Ishtiaque, Md Ramjan Ali, Todd A. Kingston, Ethan B. Secor   +4 more
wiley   +1 more source

Coordinated regulation of amino acid metabolism and transport in cereal nitrogen remobilization for grain filling. [PDF]

Front Plant Sci
Pang S, Ren X, Wu P, Lv X, Lin X, Wang D.   +5 more
europepmc   +1 more source

Programmable Crack Networks for Wide‐Range and Reversible Strain Sensing in Vertically Oriented van der Waals Molybdenum Disulfide Thin Films

Advanced Materials Technologies, EarlyView.
Vertically oriented van der Waals MoS2 thin films enable a mechanically programmable crack network for strain sensing. The initial mechanical programming protocol establishes a programmed crack configuration along weak interlayer and interdomain interfaces.
Yinli Wang, Hiroyuki Hirakata
wiley   +1 more source

High night temperature during the effective grain-filling stage affects maize yield and quality. [PDF]

Front Plant Sci
Wang S, Li T, Liu S, Zhang S, Sui P, Zhang X.   +5 more
europepmc   +1 more source

In‐House Manufacturing of 3D ECM Culture Chips via Vacuum Thermoforming for Enhanced Imaging Applications

Advanced Materials Technologies, EarlyView.
Desktop vacuum thermoforming enables rapid, low‐cost fabrication of 96‐channel polystyrene culture chips with very thin imaging interfaces. The resulting platform supports cell lines, primary cells, and patient‐derived organoids, and enables high‐resolution confocal microscopy and single‐cell visualization, providing an accessible approach for advanced
Aleksandra Fomina, Adam Tam, Jennifer Lam, Nila C. Wu, Nancy T. Li, Alison P. McGuigan   +5 more
wiley   +1 more source

Effects of Different Maturity Groups on Photosynthetic Performance, Grain-Filling Dynamics, and Yield of Maize Under Film Mulching in a Cool Region. [PDF]

Plants (Basel)
Guo Y, Song H, Zhang D, Xu C, Li F, Zhang L, Qu B, Bian S, Zhao H, Sun N.   +9 more
europepmc   +1 more source

Wafer‐Scale Top‐Down Patterning of Metal Halide Perovskites

Advanced Materials Technologies, EarlyView.
Wafer‐scale patterning of metal halide perovskite films is demonstrated on 150 mm substrates using a chemically amplified resist, polymethyl methacrylate (CAR‐PMMA) and a single reactive ion etching step. The streamlined process preserves film luminescence while defining submicrometer features across the full wafer, enabling dense, scalable integration
Federico Fabrizi, Ardeshir Esteki, Holger Lerch, Saeed Goudarzi, Liudmila Starodubtceva, Gerhard Müller‐Newen, Maryam Mohammadi, Max C. Lemme   +7 more
wiley   +1 more source