Results 211 to 220 of about 13,399,914 (288)

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

open access: yesAdvanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz   +5 more
wiley   +1 more source

Liquid‐Crystal‐Based Reconfigurable Intelligent Surface for 7 GHz Mobile Communication

open access: yesAdvanced Materials Technologies, EarlyView.
The glass‐based liquid‐crystal reconfigurable intelligent surface (LC‐RIS) integrates active‐matrix driving and blind‐greedy phase optimization within a 5G‐NR OFDM framework. This enables continuously tunable and autonomous enhancement of wireless coverage. Leveraging the transparency and manufacturability of liquid crystal panels, it is ideally suited
Tien‐Lun Ting   +5 more
wiley   +1 more source

Laser‐Induced Local De‐Doping in Organic Semiconductors

open access: yesAdvanced Materials Technologies, EarlyView.
The polymer PBTTT‐C14 doped with the small molecule acceptor F4TCNQ is considered as a benchmark material system. Mask‐free, microscale patterning of the doping level via laser‐induced heating and sublimation of dopant molecules is shown. Controlling laser irradiance and swath spacing allows dopant level control with laser‐limited resolution, opening ...
Christian Rainer   +5 more
wiley   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju   +2 more
wiley   +1 more source

Spatial Stiffness Programming in Single‐Filament Material Extrusion Through Data‐Driven Thermal Foaming

open access: yesAdvanced Materials Technologies, EarlyView.
Single‐filament material extrusion enables spatial stiffness programming through locally controlled thermal foaming of TPU. A data‐driven G‐code framework tunes porosity from 15.7% to 40.7% and hardness from 90 to 63 Shore A within and across layers. Monolithic hands and soft actuators consequently achieve distinct programmed motions without material ...
Rosanna Rifino   +3 more
wiley   +1 more source

Low‐Outgassing Liquid Metal–Silicone Composites for Multifunctional Space Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Integrating liquid metal microdroplets into a space‐grade silicone creates a multifunctional composite while preserving its inherent flexibility and low‐outgassing behavior. The composite has 11×$\times$ higher thermal conductivity while remaining thermally stable and maintaining a total mass loss of ≤$\le$ 1% under thermal vacuum testing.
Spencer Pak   +5 more
wiley   +1 more source

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