Results 171 to 180 of about 71,590 (308)

Instrumented large soil-column to investigate climate-induced ground deformation in expansive soil

open access: yes, 2017
Expansive soils are subject to significant volume change due to changing soil moisture conditions, largely in response to changing climatic conditions.
Gallage, Chaminda   +2 more
core  

Compatibility of Methacrylate Based Resins Controls Interfacial Failure and Toughness in 3D‐Printed Multimaterial Composites

open access: yesAdvanced Engineering Materials, EarlyView.
This work shows that the mechanical performance of multimaterial digital light processing (DLP) printed thermoset composites is governed by resin compatibility and interfacial design rather than spatial patterning alone. Brittle and ductile resin combinations produced premature interfacial failure, while graded interfaces and mechanically compatible ...
Ahmed M. H. Ibrahim   +3 more
wiley   +1 more source

Comparison of Triply Periodic Minimal Surface Energy Absorbers Under Uniaxial Compressive Loading

open access: yesAdvanced Engineering Materials, EarlyView.
This study investigates LCD 3D printed Triply Periodic Minimal Surface (TPMS) structures as mechanical energy absorbers. By comparing various base designs and layered combinations under uniaxial compression, it identifies that a Diamond‐Gyroid sandwich structure offers superior performance.
Sergej Grednev   +2 more
wiley   +1 more source

Influence of Si Content and Milling Duration on the Microstructure and Mechanical–Tribological Properties of AlCoCrFeNiSi High‐Entropy Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
Si‐doped AlCoCrFeNi high‐entropy alloys are synthesized by mechanical alloying to reveal the effect of Si content and milling time on phase evolution, microstructural refinement, and tribological behavior. A transition from FCC to BCC structure, significant grain refinement, and enhanced hardness and wear resistance are achieved, with the 4 at% Si ...
Mustafa Okumuş   +2 more
wiley   +1 more source

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