Results 271 to 280 of about 188,628 (354)

Histochemical study of the heart conduction system

open access: yesOkayama Igakkai Zasshi (Journal of Okayama Medical Association), 1980
openaire   +2 more sources

Harnessing Non‐Covalent Protein–Protein Interaction Domains for Production of Biocatalytic Materials Systems

open access: yesAdvanced Functional Materials, EarlyView.
Non‐covalent protein–protein interactions mediated by SH3, PDZ, or GBD domains enable the self‐assembly of stable and biocatalytically active hydrogel materials. These soft materials can be processed into monodisperse foams that, once dried, exhibit enhanced mechanical stability and activity and are easily integrated into microstructured flow ...
Julian S. Hertel   +5 more
wiley   +1 more source

MOFs and COFs in Electronics: Bridging the Gap between Intrinsic Properties and Measured Performance

open access: yesAdvanced Functional Materials, EarlyView.
Metal‐organic frameworks (MOFs) and covalent organic frameworks (COFs) hold promise for advanced electronics. However, discrepancies in reported electrical conductivities highlight the importance of measurement methodologies. This review explores intrinsic charge transport mechanisms and extrinsic factors influencing performance, and critically ...
Jonas F. Pöhls, R. Thomas Weitz
wiley   +1 more source

Defects Dynamic in Photo‐Excited CeO2 and their Influence on CO2 Photoreduction

open access: yesAdvanced Functional Materials, EarlyView.
X‐ray photoelectron spectroscopy study under light excitation is presented to track the defect dynamic (Ce4+ to Ce3+) in CeO2. Surface enhanced Raman spectroscopy confirmed the key role of Ce3+ states in controlling charge and energy transfer across the CeO2‐dye molecule interface.
Rambabu Yalavarthi   +3 more
wiley   +1 more source

Device Integration Technology for Practical Flexible Electronics Systems

open access: yesAdvanced Functional Materials, EarlyView.
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa   +5 more
wiley   +1 more source

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