A closed-box kernel function for numerical simulation of transient heat conduction. [PDF]
Zhang Y +5 more
europepmc +1 more source
Comparison of volatile and nonvolatile metabolites in green tea under hot-air drying and four heat-conduction drying patterns using widely targeted metabolomics. [PDF]
Tu Z +9 more
europepmc +1 more source
The study investigates novel semi‐finished products made of unidirectionally arranged hemp or pineapple leaf fiber‐reinforced composites produced from different matrices. The materials are analyzed in terms of their mechanical and interfacial properties and void content.
Nina Graupner +22 more
wiley +1 more source
Preparation of Phenolic Epoxy-Based Electronic Packaging Materials with High Thermal Conductivity by Creating an Interfacial Heat Conduction Network. [PDF]
Ye M +8 more
europepmc +1 more source
Photothermal Effects and Heat Conduction in Nanogranular Silicon Films. [PDF]
Kurbanova BA +4 more
europepmc +1 more source
This article presents the NFDI‐MatWerk Ontology (MWO), a Basic Formal Ontology‐based framework for interoperable research data management in materials science and engineering (MSE). Covering consortium structures, research data management resources, services, and instruments, MWO enables semantic integration, Findable, Accessible, Interoperable, and ...
Hossein Beygi Nasrabadi +4 more
wiley +1 more source
Analysis of a heterogeneous functionally graded material with a spherical void exposed to time-dependent ramp-type heating according to the TPL heat conduction model. [PDF]
Megahid SF.
europepmc +1 more source
Strong suppression of heat conduction in a laboratory replica of galaxy-cluster turbulent plasmas. [PDF]
Meinecke J +34 more
europepmc +1 more source
High‐temperature interactions between low‐sulfur Al‐killed Mn–B steel and MgO–C refractories (0 and 50 wt% recyclates) are studied via finger immersion tests (1600 °C). Surface‐active elements influence infiltration. MgO/CaS layer forms, along with spinel and calcium silicate.
Matheus Roberto Bellé +5 more
wiley +1 more source
An innovative subdivision collocation algorithm for heat conduction equation with non-uniform thermal diffusivity. [PDF]
Ejaz ST +4 more
europepmc +1 more source

