Results 141 to 150 of about 73,219 (305)
Thermal-Safe Test Scheduling for Core-Based System-on-a-Chip Integrated Circuits
Overheating has been acknowledged as a major problem during the testing of complex system-on-chip (SOC) integrated circuits. Several power-constrained test scheduling solutions have been recently proposed to tackle this problem during system integration.
Rosinger, Paul +2 more
core
Dissipation mechanisms identification of soft hollow particle-dampers in honeycomb structures for micro-vibrations environment [PDF]
Particle dampers are enclosures partially filled with metallic or glass small spheres, attached to the vibrating structure. This paper deals with replacing hard classical particles by soft hollow ones to maximize damping and mass ratio. Hence, one aspect
Heurteau, Jean-Pierre +5 more
core
MXene Wrapped Magnetic Mesocrystals for Durable Redox Catalytic Cancer Therapy and Responsive MRI
Conformal wrapping of ultrathin Ti3C2Tx MXene nanosheets on Fe3O4 mesocrystals creates topology‐stabilized Schottky junctions that direct photoinduced electron transfer under NIR irradiation. The unique architecture sustains Fenton catalysis, promotes continuous hydroxyl radical production, and provides photo‐responsive MRI contrast.
Min Jun Ko +10 more
wiley +1 more source
We introduce a capillary‐filtering‐based particle‐filling (CFPF) process that simultaneously forms vertical thermal pathways and electrical vias within µ‐pores. In situ microfluidic analysis reveals that capillary‐driven velocity gradients generate vorticity that governs µ‐platelet rotation and vertical alignment.
Yujin Mun +11 more
wiley +1 more source
Thermally oxidized MoS2‐based radio‐frequency switches enable a multifunctional platform that unifies broadband RF switching and in‐memory computation. The device achieves a cutoff frequency of 33.2 THz with high energy efficiency and supports hardware‐aware signal processing.
Juho Son +5 more
wiley +1 more source
A robust plant protein adhesive was prepared by fabricating a bi‐continuous organic–inorganic hybrid structure. Compared with traditional organic–inorganic hybrid adhesives, the addition amount of inorganic phase is increased from 0.2%–3.0% to 50%, and the strength and toughness are increased by 6 and 121 times, respectively.
Zheng Liu +10 more
wiley +1 more source
ULTRAFAST HEAT DISSIPATION DYNAMICS OF SILVER NANOPARTICLES
Time-resolved fluorescence spectroscopy has been employed to study the ultrafast heat dissipation dynamics of silver nanoparticles dispersed in methanol, tetrahydrofuran, and hexane.
P. SEN, S. P. PAL
core +1 more source
Materials for Heat Dissipation and Heat Insulation.
SOGABE, Kouichi, MIYAKE, Masaya
openaire +3 more sources
Co‐delivery of electrosprayed EDOT and oxidant enables bulk oxidative polymerization during layer‐by‐layer fabrication, creating stable, highly conductive 3D PEDOT structures. This Atomized Oxidative Polymerization (AOP) overcomes the surface deposition‐only and matrix‐limited conductivity of conventional Vapor Phase Polymerization (VPP) and PEDOT:PSS ...
Tazdik Patwary Plateau +2 more
wiley +1 more source
Local heating effects on flow and heat transfer in microchannels
This paper was presented at the 2nd Micro and Nano Flows Conference (MNF2009), which was held at Brunel University, West London, UK. The conference was organised by Brunel University and supported by the Institution of Mechanical Engineers, IPEM, the ...
2nd Micro and Nano Flows Conference (MNF2009) +2 more
core

