Results 191 to 200 of about 73,219 (305)
Improved Heat Dissipation of NR/SBR-Based Tire Tread Compounds via Hybrid Fillers of Multi-Walled Carbon Nanotube and Carbon Black. [PDF]
Kodal M +4 more
europepmc +1 more source
Harnessing the synergistic interplay of supramolecular self‐assembly, under macromolecular crowding conditions, and enzymatic‐mediated covalent crosslinking toward a stable protein‐based G‐quadruplex‐derived supramolecular bioink. This bioinspired strategy enables the biofabrication of complex and tunable ECM‐mimetic constructs, providing a platform ...
Vera Sousa +6 more
wiley +1 more source
Numerical simulation of heat dissipation characteristics in PWR high-pressure coolant pipes during cold shutdown. [PDF]
Tang F +5 more
europepmc +1 more source
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. [PDF]
Tan L +5 more
europepmc +1 more source
Metasurface‐engineered NC‐TENG arrays integrate tactile pressure mapping, non‐contact gesture sensing, and acoustic signal readouts in one ultrathin module, and outperforms pristine PDMS in terms of electrical output and real‐time spatial mapping for next‐gen wearables.
Injamamul Arief +12 more
wiley +1 more source
Sea Anemone-Inspired Phase Change Composites for Efficient Heat Dissipation and Ultra-High Electromagnetic Interference Shielding. [PDF]
He X +8 more
europepmc +1 more source
Evaluation of Surfactants on Graphene Dispersion and Thermal Performance for Heat Dissipation Coating. [PDF]
Cheng C, Shi WH, Teng TP, Yang CR.
europepmc +1 more source
A Nb‐proximitized Josephson junction based on a WTe2/α‐Fe2O3 heterostructure exhibits a robust superconducting diode effect with programmable polarity. The diode direction can be trained by magnetic fields and switched by temperature cycling, revealing tunable finite‐momentum pairing states and competing superconducting states in symmetry‐broken ...
Enze Zhang +9 more
wiley +1 more source
Heat dissipation in ball grid array packages
This thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It aims to study the behavior of heat dissipation in a single BGA solder joint as well as multiple solder joints through the use of analytical, numerical and
Ying, Teck Mun.
core
Research on Heat Dissipation of Multi-Chip LED Filament Package. [PDF]
Tan L +5 more
europepmc +1 more source

