Results 191 to 200 of about 73,219 (305)

Stable Protein‐Based G‐Quadruplex‐Derived Supramolecular Bioinks as Tunable ECM‐Mimetic Constructs Assembled by Combining Non‐Covalent and Covalent Strategies

open access: yesAdvanced Materials, EarlyView.
Harnessing the synergistic interplay of supramolecular self‐assembly, under macromolecular crowding conditions, and enzymatic‐mediated covalent crosslinking toward a stable protein‐based G‐quadruplex‐derived supramolecular bioink. This bioinspired strategy enables the biofabrication of complex and tunable ECM‐mimetic constructs, providing a platform ...
Vera Sousa   +6 more
wiley   +1 more source

Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. [PDF]

open access: yesMicromachines (Basel), 2022
Tan L   +5 more
europepmc   +1 more source

Large‐Area 2D Metasurface‐Based Triboelectric E‐Skin Arrays: Contact & Proximity Tactile Mapping with Broadband Acoustic Readouts

open access: yesAdvanced Materials, EarlyView.
Metasurface‐engineered NC‐TENG arrays integrate tactile pressure mapping, non‐contact gesture sensing, and acoustic signal readouts in one ultrathin module, and outperforms pristine PDMS in terms of electrical output and real‐time spatial mapping for next‐gen wearables.
Injamamul Arief   +12 more
wiley   +1 more source

Thermal‐Driven Diode Polarity Switching From Competing Helical Superconducting States in WTe2/α‐Fe2O3 Heterostructures

open access: yesAdvanced Materials, EarlyView.
A Nb‐proximitized Josephson junction based on a WTe2/α‐Fe2O3 heterostructure exhibits a robust superconducting diode effect with programmable polarity. The diode direction can be trained by magnetic fields and switched by temperature cycling, revealing tunable finite‐momentum pairing states and competing superconducting states in symmetry‐broken ...
Enze Zhang   +9 more
wiley   +1 more source

Heat dissipation in ball grid array packages

open access: yes, 2000
This thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It aims to study the behavior of heat dissipation in a single BGA solder joint as well as multiple solder joints through the use of analytical, numerical and
Ying, Teck Mun.
core  

Research on Heat Dissipation of Multi-Chip LED Filament Package. [PDF]

open access: yesMicromachines (Basel), 2021
Tan L   +5 more
europepmc   +1 more source

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