Results 21 to 30 of about 1,668,939 (274)

Design of heat dissipation structure of host computer of mine through-the-earth communication based on heat pipe technology

Gong-kuang zidonghua, 2016
In order to solve problem of heat dissipation of host computer of mine through-the-earth communication system, a heat dissipation structure of host computer of mine through-the-earth communication based on heat technology was designed.
WANG Kan
doaj   +1 more source

Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

Micromachines, 2021
Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with
Yanan Yu, Yafei Yin, Yuhang Li, Min Li, Jizhou Song   +4 more
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Analysis of Natural Heat Dissipation Capacity of Hydraulic Tank and Relevant Influencing Factors

Machines, 2022
This paper aims to study the natural heat dissipation capacity of a hydraulic tank during its miniaturization revolution. A theoretical model of heat dissipation was built up on the basis of experimental analysis. Then, the natural heat dissipation power
Fugang Zhai, Xiaonan Wang, Zhiqiang He, Yu Chen, Zi Ye, Jing Yao   +5 more
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Thermal effect of plastic dissipation at the crack tip on the stress intensity factor under cyclic loading [PDF]

, 2011
The authors acknowledge Arts et Métiers ParisTech and Fondation Arts et Métiers for the financial support of Paul C. Paris’ stay at LAMEFIP in 2009. The encouragement of Prof. Ivan Iordanoff, Director of LAMEFIP, is acknowledged with thanks.
PARIS, Paul C., T. Palin-Luc, PARIS, Paul Croce, PALIN-LUC, Thierry, RANC, Nicolas, P.C. Paris, PALIN LUC, Thierry, N. Ranc, Paris, Paul   +8 more
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Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation

Jin'gangshi yu moliao moju gongcheng
With the rise of third-generation semiconductors, electronic devices are evolving towards high-power, miniaturization, and integration. Traditional heat dissipation technologies are no longer sufficient to meet the heat dissipation requirements of high ...
Shibo DENG, Yongqi XIA, Mingtao WU, Xiaobin YUE, Dajiang LEI   +4 more
doaj   +3 more sources

Study and optimization of panel-type radiator parameters for oil-immersed transformer

电力工程技术, 2023
Panel-type radiator plays an important role in the heat dissipation of oil-immersed transformers. To study the influence of structural parameters of panel-type radiator on its heat dissipation performance, the multi-variable design matrix is designed by ...
MIAO Ale, BAI Xiaochun, ZHU Chao, WANG Lyu, LIU Yingwen   +4 more
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Effect of Heat Dissipation Rate on Microstructure and Mechanical Properties of Al_0.5FeCoCrNi High-Entropy Alloy Wall Fabricated by Laser Melting Deposition

Metals, 2022
High-entropy alloys (HEAs) are a new type of multi-component alloy. The design of the compositions breaks the design ideas of traditional alloys and shows many excellent properties.
Yanan Yan, Yinbao Tian, Yangchuan Cai, Jian Han, Xuesong Zhang   +4 more
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Design and Finite Element Analysis of Brake Disc Heat Dissipation Rib for Urban Rail Transit Vehicle

Chengshi guidao jiaotong yanjiu
[Objective] At present, the heat dissipation performance of brake discs for urban rail transit vehicles needs to be improved. Therefore, it is necessary to study the optimization design scheme for a new type of heat dissipation ribs. [Method] By adopting
WU Na, SONG Hao, YANG Jianwei, WU Chunguang, WANG Chengxu   +4 more
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Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB

Applied Sciences, 2023
The quad flat no-lead package (QFN) is widely used in integrated circuits due to its advantages in performance and cost. With the increasing power of electronic products, effective heat dissipation from QFN packages has become crucial to prevent product ...
Ziyi Yuan, Dongyan Ding, Wenlong Zhang
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Research on heat dissipation technology for multi-channel high power GaN T/R module

Dianzi Jishu Yingyong
This paper summarizes the problems and challenges faced in the heat dissipation design of multi-channel high-power T/R module, and analyzes the heat dissipation capabilities of various heat dissipation solutions.
Zhang Wenchao, Sun Jiaqing
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