Results 241 to 250 of about 3,155,393 (333)
Simulation Method of Heat Release Rate for Medium Speed Diesel Engine
, 1989 Hiromi Kondo +3 more
openalex +2 more sources
Advanced Engineering Materials, EarlyView.Laser remelting of a CrMnFeCoNi high‐entropy alloy reveals that optimal chemical homogenization occurs between 30 and 40 J·mm−2. Within this range, elemental segregation is reduced by over 30% compared to the as‐cast state. The study establishes this window as a fast, effective alternative to prolonged annealing for achieving uniform elemental ...
Ajay Talbot +5 more
wiley +1 more source
Important fuel-related topics in 1988. 7. Combustion equipment and heat engines.
, 1989 Susumu Sato
openalex +2 more sources
Advanced Engineering Materials, EarlyView.The dielectric elastomer‐based electropneumatic device (DE‐EPD) is a vacuum‐assisted ventricular assist device (VAD) that delivers high performance (85 mmHg, 6.8 L min−1) with low power consumption. Unlike traditional motor‐driven VADs, it is lightweight, quiet, energy‐efficient, and provides pulsatile flow. Validated in a simulated circulation system,
Amine Benouhiba +6 more
wiley +1 more source
Quantum Heat Engine Using Electromagnetically Induced Transparency.
Physical Review Letters, 2017 Yueyang Zou +4 more
semanticscholar +1 more source
Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets
Advanced Engineering Materials, EarlyView.Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian +5 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source