Results 141 to 150 of about 181,310 (279)

Heterogeneous Media Heat Transfer Simulations Based on 3D-Fractional Parametric Laplace Kernel

open access: yesInternational Journal of Differential Equations
This paper introduces a new Mittag–Leffler–Laplace memory kernel defined by Φ˜μ,ν,κα,ρs=∫0∞Eρ−μξκ/κξνα−1e−sξdξ, s>0, and develops a unified framework for modeling heat transfer in heterogeneous media with nonlocal temporal memory.
Rabha W. Ibrahim   +2 more
doaj   +1 more source

Engineering Neuronal Network Connectivity Through Precise and Scalable Electrical Modulation

open access: yesAdvanced Science, EarlyView.
This study presents a scalable all‐electrical method for precise neuronal‐circuit reconfiguration based on high‐density microelectrode arrays. By employing biologically inspired plasticity rules, targeted connectivity changes were successfully induced and quantified across diverse neuronal preparations.
Sreedhar S. Kumar   +10 more
wiley   +1 more source

Towards a Holistic Cortical Thickness Descriptor: Heat Kernel-Based Grey Matter Morphology Signatures. [PDF]

open access: yesNeuroimage, 2017
Wang G   +2 more
europepmc   +1 more source

Stress‐to‐Light Conversion in an Earth‐Abundant Oxide Semiconductor

open access: yesAdvanced Science, EarlyView.
Stress‐to‐light conversion in solids represents a unique photonic functionality, yet it has never been realized in a chemically simple and sustainable material. Here, we show that sustainable semiconductor ZnO exhibits strong near‐infrared (NIR) luminescence under elastic stress when defect‐engineered to stabilize the p‐type state.
Tomoki Uchiyama   +7 more
wiley   +1 more source

Scalable Wheat Bran‐Algae Composites for Edible Electronics with Spray‐Coated Food‐Grade Conductive Inks

open access: yesAdvanced Electronic Materials, EarlyView.
A fully edible wheat bran–algae substrate is fabricated through scalable mould‐compression and spray‐coating, enabling robust, food‐grade platforms for sustainable electronics. A chitosan barrier improves water resistance and ink compatibility, while activated‐carbon conductive films form uniform electrodes with Ohmic behaviour.
Jaz Johari   +7 more
wiley   +1 more source

Multi-scale Heat Kernel based Volumetric Morphology Signature. [PDF]

open access: yesMed Image Comput Comput Assist Interv, 2015
Wang G, Wang Y.
europepmc   +1 more source

People Counting and Positioning Using Low‐Resolution Infrared Images for FeFET‐Based In‐Memory Computing

open access: yesAdvanced Electronic Materials, EarlyView.
In this work, low‐resolution infrared imaging is combined with a 28 nm FeFET IMC architecture to enable compact, energy‐efficient edge inference. MLC FeFET devices are experimentally characterized, and controlled multi‐level current accumulation is validated at crossbar array level.
Alptekin Vardar   +9 more
wiley   +1 more source

Sustainable Carbon Fibers Enable Stable Long‐Term Lithium Metal Deposition for Prospective Zero‐Excess Lithium Metal Batteries

open access: yesAdvanced Energy Materials, EarlyView.
This work presents lightweight, lignin‐derived carbon fiber current collectors that enable controlled lithium deposition. Structural defects and intermediate‐sized pores stabilize pre‐nucleation quasi‐metallic lithium clusters, promoting uniform lithium plating and stripping.
Samantha L. S. Southern   +13 more
wiley   +1 more source

Smart Exploration of Perovskite Photovoltaics: From AI Driven Discovery to Autonomous Laboratories

open access: yesAdvanced Energy Materials, EarlyView.
In this review, we summarize the fundamentals of AI in automated materials science, and review AI applications in perovskite solar cells. Then, we sum up recent progress in AI‐guided manufacturing optimization, and highlight AI‐driven high‐throughput and autonomous laboratories.
Wenning Chen   +4 more
wiley   +1 more source

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