Results 191 to 200 of about 1,658,194 (247)
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SAE Technical Paper Series, 1999
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
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<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
openaire +1 more source
Optimization of heat sink fin geometries for heat sinks in natural convection
[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 2003An approach for determining the optimum fin configurations for a given heat sink in natural convection is developed. Incorporation of minimization routines into the analysis eliminates the manual, iterative design analysis and identifies the optimum design. Optimization of fin geometry for heat sinks in natural convection with rectangular cross section
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Thermal comparison of plate, extrusion heat sink, and skive heat sink
Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2002Due to the high power dissipation values of power amplifiers, large temperature gradients exist, resulting in localized hot spots around the devices. These hot spots cause high device junction temperatures. Generally speaking, the higher junction temperature increases, the lower reliability will be. Thus, improving the heat spreading is very important.
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1965
This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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2014
Finned heat sinks are used in computers to promote heat transfer from the Integrated Circuit (IC) chips to cooling air. This chapter provides the background information and the tutorial materials about heat sinks. First, the mechanism of heat generation by electronic circuits is explained.
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Finned heat sinks are used in computers to promote heat transfer from the Integrated Circuit (IC) chips to cooling air. This chapter provides the background information and the tutorial materials about heat sinks. First, the mechanism of heat generation by electronic circuits is explained.
openaire +1 more source
Study of the performance of an integrated liquid cooling heat sink for high-power IGBTs
Applied Thermal Engineering, 2021Minqiang Pan
exaly
Hydraulic and thermal performances of metal foam and pin fin hybrid heat sink
Applied Thermal Engineering, 2020Liang Gong +2 more
exaly
Evaluation of heat sink performance using PCM and vapor chamber/heat pipe
Renewable Energy, 2021Morteza Ghanbarpour +2 more
exaly