Results 191 to 200 of about 2,705,063 (286)

Carbide Slag-Assisted Steam Gasification of Sewage Sludge for Hydrogen-Rich Syngas Production and Heavy Metal Stabilization. [PDF]

ACS Omega
Liu W, Zhang Z, Yao C, Zheng D, Zhang L, Li J, Li Z.   +6 more
europepmc   +1 more source

Toward Perception‐Native Electronic Skin: Bio‐Inspired In‐/Near‐Sensor and Neuromorphic Computing for Humanoid Robots

Advanced Materials Technologies, EarlyView.
Dense tactile streams from across the humanoid body converge on collide in a central wiring and data bottleneck. By relocating computation closer to and then into the skin itself, near‐ and in‐sensor architectures, together with neuromorphic computing, chart a path toward perception‐native electronic skin, in which the conversion of stimulus into ...
Mijin Kim, Chang‐Jae Beak, Jiyoung Park, Youngdo Jung, Sunjong Oh, Sin‐Hyung Lee, Bo‐Yeon Lee   +6 more
wiley   +1 more source

Nanotechnology for Radionuclide and Heavy Metal Removal in Mining-Impacted Water Systems: Advances, Challenges, and Future Directions. [PDF]

Toxics
Selala LG, Sithole T, Rathebe PC.
europepmc   +1 more source

Hierarchically Wrinkled Silver Ink as a Platform for Fully Integrated Stretchable Electronic Systems

Advanced Materials Technologies, EarlyView.
Silver Hierarchical Responsive ink (SHRink), a universal approach for the fabrication of highly stretchable interconnects, wirings, and skin‐interfaced electrodes, is realized through low‐cost, scalable spray‐printing and transfer‐printing. The SHRink demonstrates high electrical conductivity (1.2E04 S cm−1) and large stretchability (235% max fracture ...
Junye Li, Hao Wang, Xinlei Chen, Mehmet Senel, Patrick Rwei, Sara Marmarchi, David Clymer, Blossom Sundarii Hak‐Khem, Nhi Nguyen, Chengyang Qian, Matt Thomson, Michelle Khine   +11 more
wiley   +1 more source

Selenium predominance in heavy metal mixtures is associated with hyperuricemia in Chinese adults: the role of insulin resistance. [PDF]

Front Public Health
Lai JF, Zhang YQ, Zhang YT, He Y, Tu HX, Yang Q, Bao WW, Liang LX, Huang JW, Gui ZH, Hu LW, Lin LZ, Zhou Y, Xu B, Dong GH, Song HD, Wu FH, Liu RQ.   +17 more
europepmc   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

Advanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju, Rumana Hossain, Veena Sahajwalla   +2 more
wiley   +1 more source

Impacts of Combined Microplastics and Heavy Metal Pollution on Aquatic Ecological Health: Insights from Trophic Levels. [PDF]

Toxics
Liu H, Xu H, Rao C.
europepmc   +1 more source

Chitin‐Chitosan Cryogels for the Reversible Sequestration and Recovery of Heavy Metals From Wastewater

Advanced Materials Technologies, EarlyView.
Chitin‐chitosan cryogels with degrees of N‐acetylation from 12.2% to 71.4% are fabricated by dissolution, coagulation and lyophilization for the sequestration of heavy metals from water. Colorimetry and differential pulse voltammetry showed controlled adsorption and desorption capacities for As5+, Co2+ and Cu2+, making this material attractive for ...
Marta García‐Castrillo, Maialen Uribarrena, Jorge Sáiz, Guillermo Copello, Erlantz Lizundia   +4 more
wiley   +1 more source

Association of Blood Heavy Metal Concentrations with Angiographic Coronary Artery Disease in a Consecutive Single-Center Cardiac Catheterization Cohort. [PDF]

Cardiovasc Toxicol
Taylor JD, Shah P, Specht A, Shah M, Duckett M, Locquiao C, Lizama K, Salem E, McKown H, Glynn P, Vidovich MI.   +10 more
europepmc   +1 more source

Vertical Gate‐All‐Around SiGeSn/GeSn/SiGeSn Nanowire Transistors for Energy‐Efficient Electronics

Advanced Materials Technologies, EarlyView.
Band‐engineered SiGeSn/GeSn/SiGeSn heterostructures enable complementary vertical nanowire MOSFETs and steep slope tunnel FETs (TFETs) within a unified Group‐IV platform. Leakage suppression and tunnelling‐path engineering demonstrate an effective strategy for future low‐power and energy‐efficient integrated electronics.
Kenta Moto, Yannik Junk, Marvin Frauenrath, Florian Bärwolf, Jean‐Michel Hartmann, Andreas Mai, Detlev Grützmacher, Joachim Knoch, Dan Buca, Qing‐Tai Zhao   +9 more
wiley   +1 more source